Lighting module and lighting apparatus having thereof

ABSTRACT

A lighting module according to an embodiment of the invention includes: a substrate; a plurality of light emitting devices disposed in N rows (N is an integer of 1 or more) on the substrate; a first resin layer covering the plurality of light emitting devices; a first diffusion layer disposed on the first resin layer and diffusing light emitted from the first resin layer; and a second diffusion layer disposed on the first diffusion layer and diffusing light emitted from the first diffusion layer, wherein the first diffusion layer includes a diffusing agent, and the second diffusion layer includes at least one of a phosphor and ink particles.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a Continuation of U.S. application Ser. No.16/138,734, filed Sep. 21, 2018, which claims priority under 35 U.S.C. §119(a) of Korean Patent Application No. 10-2017-0123558 filed on Sep.25, 2017, and Application No. 10-2018-0096012 filed on Aug. 17, 2018,which are hereby incorporated by reference in their entirety.

BACKGROUND 1. Field of the Invention

Embodiments of the invention relate to a lighting module having a lightemitting device.

Embodiments of the invention relate to a lighting module having a lightemitting device and a plurality of resin layers.

Embodiments of the invention relate to a lighting module providing asurface light source.

Embodiments of the invention relate to a lighting unit or a vehicle lamphaving a lighting module.

2. Discussion of Related Art

Conventional lighting applications include not only a vehicle lightingbut also a backlight for a display and a signage.

A light emitting device, for example, a light emitting diode (LED) hasadvantages such as low power consumption, semi-permanent lifetime, fastresponse speed, safety, environmental friendliness compared toconventional light sources such as fluorescent lamps and incandescentlamps. Such an LED has been applied to various lighting apparatuses suchas various display devices, indoor lights or outdoor lights, or thelike.

Recently, a lamp employing an LED has been proposed as a vehicle lightsource. Compared to incandescent lamps, an LED has an advantage in lowpower consumption. However, since an emitting angle of light emittedfrom an LED is small, when the LED is used as a vehicle lamp, it isrequired to increase a light emitting area of a lamp using the LED.

Since a size of an LED is small, it is possible to increase a degree offreedom of design of a lamp, and the LED has economic efficiency due tothe semi-permanent lifetime.

SUMMARY OF THE INVENTION

An embodiment of the invention may provide a lighting module providing asurface light source.

An embodiment of the invention may provide a lighting module in which aresin layer is disposed on a plurality of light emitting devices.

An embodiment of the invention may provide a lighting module in which aplurality of resin layers are disposed on a substrate and a lightemitting device.

An embodiment of the invention may provide an lighting module in which aplurality of resin layers are disposed on light emitting devices thatemit light through an upper surface and a plurality of side surfacesthereof.

An embodiment of the invention may provide a lighting module in which aplurality of resin layers are disposed on a substrate and a lightemitting device, and a phosphor is included in at least one of theplurality of resin layers.

An embodiment of the invention may provide a lighting module in which aplurality of resin layers disposed on a substrate and a light emittingdevice and ink particles are included in at least one of the pluralityof resin layers.

An embodiment of the invention may provide a lighting module in which aresin layer or a diffusion layer is disposed on a substrate and a lightemitting device and having at least one or more of a phosphor, inkparticles, and a diffusing agent.

An embodiment of the invention may provide a lighting module in which aplurality of resin layers are disposed on a substrate and a lightemitting device, and a diffusing agent is included in a layer adjacentto the light emitting device among the plurality of resin layers.

An embodiment of the invention may provide a lighting module in which aresin layer with a phosphor is spaced apart from a substrate and a lightemitting device.

An embodiment of the invention may provide a lighting module in which aresin layer with ink particles is spaced apart from a substrate and alight emitting device.

An embodiment of the invention may provide a lighting module in which aphosphor and ink particles are disposed in at least one of resin layersdisposed on a light emitting device.

An embodiment of the invention may provide a lighting module in whichink particles are added to the uppermost layer among a plurality ofresin layers disposed on light emitting devices.

An embodiment of the invention may provide a flexible lighting modulehaving light emitting devices and a plurality of resin layers.

An embodiment of the invention may provide a lighting module in whichlight extraction efficiency and backlighting characteristics areimproved.

An embodiment of the invention may provide a lighting module irradiatinga surface light source and a lighting apparatus having the same.

An embodiment of the invention may provide a lighting unit, a liquidcrystal display device, or a vehicle lamp having a lighting module.

A lighting module according to an embodiment of the invention comprises:a substrate; a plurality of light emitting devices disposed in N rows (Nis an integer of 1 or more) on the substrate; a first resin layercovering the plurality of light emitting devices; a first diffusionlayer disposed on the first resin layer and diffusing light emitted fromthe first resin layer; and a second diffusion layer disposed on thefirst diffusion layer and diffusing light emitted from the firstdiffusion layer, wherein the first diffusion layer includes a diffusingagent and the second diffusion layer includes a phosphor, and aninterval between the plurality of light emitting devices is equal to orgreater than a thickness of the first resin layer, and light emitted tothe outside through the second diffusion layer may include lightuniformity of 90% or more.

According to an embodiment of the invention, a straight distance betweena lower surface of the substrate and an upper surface of the seconddiffusion layer may be 220% or less of the thickness of the first resinlayer, a thickness of the first diffusion layer may be in the range of40% to 80% of the thickness of the first resin layer, and a thickness ofthe second diffusion layer may be 25% or less of the thickness of thefirst diffusion layer.

According to an embodiment of the invention, a size of the diffusingagent may be greater than a wavelength of light emitted from the lightemitting device, the size of the diffusing agent may be in the range of4 μm to 6 μm, and a refractive index of the diffusing agent may be inthe range of 1.4 to 2.0.

According to an embodiment of the invention, the phosphor may have asize in the range of 1 μm to 100 μm, and a content of the phosphor mayinclude a range of 40 wt % to 60 wt % in a resin material of the seconddiffusion layer.

According to an embodiment of the invention, the first resin layer andthe first diffusion layer may be formed of the same resin material, andthe second diffusion layer may be formed of a resin material differentfrom the first diffusion layer.

According to an embodiment of the invention, a refractive index of thesecond diffusion layer may be in the range of 1.45 to 1.6, the lightemitting device may emit blue light, the second diffusion layer may emitred light, and a surface color of the second diffusion layer may includered-based color.

According to an embodiment of the invention, a content of the phosphoradded to the second diffusion layer may be 5 times or higher than acontent of the diffusing agent added to the first diffusion layer, andthe second diffusion layer may include a side portion extending from anedge of an upper surface of the first diffusion layer toward thesubstrate.

A lighting module according to an embodiment of the invention comprises:a substrate; a plurality of light emitting devices on the substrate; afirst resin layer for molding the plurality of light emitting devices;and a second resin layer comprising ink particles on the first resinlayer, wherein at least one of the first resin layer and the secondresin layer comprises a phosphor.

According to an embodiment of the invention, wherein a content of theink particles is smaller than a content of the phosphor.

According to an embodiment of the invention, wherein the phosphor isdisposed in the second resin layer, wherein a content of the phosphor inthe second resin layer is in a range of 12 wt % to 23 wt %, and whereina content of the ink particles in the second resin layer is in a rangeof 3 wt % to 13 wt %.

According to an embodiment of the invention, wherein the phosphor isdisposed in the second resin layer and spaced apart from the lightemitting devices, wherein a thickness of the second resin layer isthinner than a thickness of the first resin layer.

According to an embodiment of the invention, wherein the phosphor emitslight having a longer wavelength than a wavelength of the light emittedfrom the light emitting device, and wherein the ink particles have asame color series as the phosphor.

According to an embodiment of the invention, wherein the wavelengthemitted from the phosphor and the ink particle comprise a same redcolor, and wherein the light emitting device emits a wavelength in arange of 420 nm to 470 nm.

According to an embodiment of the invention, wherein a straight distancebetween a lower surface of the substrate and an upper surface of thesecond resin layer is 220% or less of the thickness of the first resinlayer, wherein the thickness of the second resin layer comprises a rangeof 40% to 80% of the thickness of the first resin layer.

According to an embodiment of the invention, wherein the second resinlayer comprises a side portions extending on a side surface of the firstresin layer, and wherein the side portion of the second resin layercontacts the substrate and comprises the phosphor and the ink particles.

According to an embodiment of the invention, wherein the first resinlayer comprises a diffusing agent, wherein the diffusing agent is in therange of 4 μm to 6 μm, and wherein the diffusing agent has a refractiveindex ranging from 1.4 to 2.

According to an embodiment of the invention, a light shielding portiondisposed between the first and second resin layers and overlapped withthe light emitting device in a vertical direction.

According to an embodiment of the invention, wherein a surface of thesecond resin layer is red, wherein a chroma value at a surface of thesecond resin layer is lower than a chroma value of light emitted throughthe second resin layer.

According to an embodiment of the invention, wherein the light emittingdevice comprises: a light transmitting substrate; a light emittingstructure including a first conductivity type semiconductor layer, anactive layer, and a second conductivity type semiconductor layer underthe light transmitting substrate; a first electrode connected to thefirst conductivity type semiconductor layer under the light emittingstructure; and a second electrode connected to the second conductivitytype semiconductor layer under the light emitting structure, and whereinthe first electrode and the second electrode of the light emittingdevice face the substrate and are electrically connected to thesubstrate.

A lighting module according to an embodiment of the invention comprises:a substrate; a plurality of light emitting devices disposed on thesubstrate in N rows (N is an integer of 1 or more); a first diffusionlayer for diffusing light emitted from the light emitting device; asecond diffusion layer for diffusing light emitted from the lightemitting device; and a third diffusion layer for diffusing light emittedfrom the light emitting device, wherein the first diffusion layercomprises a diffusing agent, wherein the second diffusion layercomprises a phosphor, wherein the third diffusion layer includes atleast one of a phosphor and ink particles, wherein an interval betweenthe light emitting devices is equal to or greater than a thickness ofeach of the first diffusion layer, the second diffusion layer and thethird diffusion layer, wherein the thickness of the first and seconddiffusion layers is smaller than the thickness of the first diffusionlayer.

BRIEF DESCRIPTION OF THE DRAWINGS

The patent or application file contains at least one drawing executed incolor. Copies of this patent or patent application publication withcolor drawing(s) will be provided by the Office upon request and paymentof the necessary fee.

FIG. 1 is a side sectional view illustrating a lighting module accordingto a first embodiment of the invention.

FIG. 2 is an example of a plan view of the lighting module of FIG. 1.

FIG. 3 is a view illustrating a first modified example of the lightingmodule of FIG. 1.

FIG. 4 is a view illustrating a second modified example of the lightingmodule of FIG. 1.

FIG. 5 is another example of the lighting module of FIG. 4.

FIG. 6 is a view illustrating a third modified example of the lightingmodule of FIG. 1.

FIG. 7 is another example of the lighting module of FIG. 6.

FIG. 8 is a view illustrating a fourth modified example of the lightingmodule of FIG. 1.

FIG. 9 is another example of the lighting module of FIG. 8.

FIG. 10 is another example of the lighting module of FIG. 1.

FIG. 11 is a fifth modified example of the lighting module of FIG. 1.

FIG. 12 is another example of the lighting module of FIG. 11.

FIG. 13 is a sixth modified example of the lighting module of FIG. 1.

FIG. 14 is an example of a side sectional view of a lighting moduleaccording to a second embodiment of the invention.

FIG. 15 is a first modified example of the lighting module according tothe second embodiment.

FIG. 16 is a second modified example of the lighting module of FIG. 15.

FIG. 17 is a third modified example of the lighting module according tothe second embodiment.

FIG. 18 is a fourth modified example of the lighting module according tothe second embodiment.

FIG. 19 is a fifth modified example of the lighting module according tothe second embodiment.

FIG. 20 is a sixth modified example of the lighting module according tothe second embodiment.

FIG. 21 is a seventh modified example of the lighting module accordingto the second embodiment.

FIG. 22 is an eighth modified example of the lighting module accordingto the second embodiment.

FIG. 23 is a ninth modified example of the lighting module according tothe second embodiment.

FIG. 24 is a tenth modified example of the lighting module according tothe second embodiment.

FIG. 25 is an eleventh modified example of the lighting module accordingto the second embodiment.

FIG. 26 is a view for explaining an example of change in surface coloraccording to turn-on and turn-off of a light emitting device in a resinlayer having ink particles according to the second embodiment.

FIG. 27 is a graph illustrating light uniformity according to arefractive index of a resin in a lighting module according to anembodiment of the invention.

FIG. 28 is a graph illustrating light efficiency according to arefractive index of a resin in a lighting module according to anembodiment of the invention.

FIG. 29 is a graph illustrating light uniformity according to arefractive index of a diffusing agent added in a resin in a lightingmodule according to an embodiment of the invention.

FIG. 30 is a graph illustrating light uniformity according to a size ofa diffusing agent added in a resin in a lighting module according to anembodiment of the invention.

FIGS. 31 (a) and 31 (b) are graphs illustrating changes in chromaticitydepending on the density of a diffusing agent added in a resin and anamount of a phosphor in a lighting module according to an embodiment ofthe invention.

FIG. 32 is an example of a light emitting device in a lighting moduleaccording to an embodiment of the invention.

FIGS. 33 (a) and (b) are views comparing luminance distributions oflight emitting devices of Comparative Example and an embodiment.

FIG. 34 is a view illustrating a beam pattern distribution of the lightemitting devices of Comparative Example and the embodiment of FIG. 33.

FIG. 35 is a view illustrating a comparison of a color tone of areference example with color tones of surface colors of Examples 1 to 9in a state in which a light emitting device is turned off in thelighting module according to the second embodiment.

FIG. 36 is a view illustrating a comparison of a color tone of areference example with color tones of surface colors of Examples 1 to 9in a state in which a light emitting device is turned on in the lightingmodule according to the second embodiment.

FIG. 37 is a view illustrating a comparison of light flux distributionsaccording to a sample and a case of the lighting module according to thesecond embodiment.

FIG. 38 is a view illustrating a comparison of a color coordinatedistribution by case according to contents of a phosphor and inkparticles in the lighting module according to the second embodiment.

FIG. 39 is a plan view of a vehicle to which a lamp having a lightingmodule according to an embodiment is applied.

FIG. 40 is a view of a lamp having a lighting module or a lightingapparatus according to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, preferred embodiments of the invention will be described indetail with reference to the accompanying drawings.

However, the technical spirit of the invention is not limited to someembodiments to be described, and may be implemented in various otherforms, and one or more of the components may be selectively combined andsubstituted for use within the scope of the technical spirit of theinvention. In addition, the terms (including technical and scientificterms) used in the embodiments of the invention, unless specificallydefined and described explicitly, can be interpreted in a meaning thatmay be generally understood by those having ordinary skill in the art towhich the invention pertains, and terms that are commonly used such asterms defined in a dictionary should be able to interpret their meaningsin consideration of the contextual meaning of the relevant technology.Further, the terms used in the embodiments of the invention are forexplaining the embodiments and are not intended to limit the invention.In this specification, the singular forms also may include plural formsunless otherwise specifically stated in a phrase, and in the case inwhich at least one (or one or more) of A and (and) B, C is stated, itmay include one or more of all combinations that may be combined with A,B, and C. In describing the components of the embodiments of theinvention, terms such as first, second, A, B, (a), and (b) can be used.Such terms are only for distinguishing the component from othercomponent, and may not be determined by the term by the nature, sequenceor procedure etc. of the corresponding constituent element. And when itis described that a component is “connected”, “coupled” or “joined” toanother component, the description may include not only being directlyconnected, coupled or joined to the other component but also being“connected”, “coupled” or “joined” by another component between thecomponent and the other component. In addition, in the case of beingdescribed as being formed or disposed “above (on)” or “below (under)” ofeach component, the description includes not only when two componentsare in direct contact with each other, but also when one or more othercomponents are formed or disposed between the two components. Inaddition, when expressed as “above (on)” or “below (under)”, it mayrefer to a downward direction as well as an upward direction withrespect to one element.

A lighting apparatus according to the invention may be applied tovarious lamp devices requiring lighting, for example, a vehicle lamp, ahome lighting apparatus, or an industrial lighting apparatus. Forexample, when alighting apparatus is applied to a vehicle lamp, it maybe applied to a head lamp, a side marker lamp, a side mirror lamp, a foglamp, a tail lamp, a stop lamp, a daytime running light, a vehicleinterior lighting, a door scarf, rear combination lamps, a backup lamp,and the like. A lighting apparatus of the invention may also be appliedto indoor and outdoor advertisement devices, display devices, andvarious types of electric vehicles fields, and also may be applicable toall other lighting related fields and advertisement related fields thatare currently being developed and commercialized or that may be realizedby technological development in the future.

First Embodiment

FIG. 1 is a side cross-sectional view illustrating a lighting moduleaccording to a first embodiment, and FIG. 2 is an example of a plan viewof the lighting module of FIG. 1.

Referring to FIGS. 1 and 2, a lighting module 100 may include asubstrate 11, a light emitting device 21 disposed on the substrate 11, afirst resin layer 31 covering the light emitting device 21 on thesubstrate 11, and at least one or more of upper layers 41 and 51 on thefirst resin layer 31.

The lighting module 100 may emit light emitted from the light emittingdevice 21 to a surface light source. The lighting module 100 may includea reflection member disposed at an upper surface of the substrate 11.The reflection member may reflect light traveling to the upper surfaceof the substrate 11 to the first resin layer 31. The light emittingdevice 21 may be disposed on the substrate 11 in plural. In the lightingmodule 100, a plurality of light emitting devices 21 may be arranged inN columns (N is an integer of 1 or more) or/and M rows (M is an integerof 1 or more). The plurality of light emitting devices 21 may bearranged in the N columns and M rows (N and M are integers of 2 or more)as shown in FIG. 2. The lighting module 100 may be applied to variouslamp devices requiring lighting, such as a vehicle lamp, a home lightingapparatus, or an industrial lighting apparatus. For example, when alighting apparatus is applied to a vehicle lamp, it may be applied to ahead lamp, a side marker lamp, a side mirror lamp, a fog lamp, a taillamp, a turn signal lamp, a stop lamp, a daytime running light, vehicleinterior light, a door scarf, rear combination lamps, a backup lamp, andthe like.

As shown in FIGS. 1 and 2, the substrate 11 may function as a basemember or a support member located at lower portions of the lightemitting device 21 and the first resin layer 31.

The substrate 11 includes a printed circuit board (PCB). The substrate11, for example, may include at least one of a resin-based printedcircuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB,and an FR-4 substrate. The substrate 11, for example, may include aflexible PCB or a rigid PCB. The upper surface of the substrate 11 hasan X-axis and Y-axis plane, and a thickness of the substrate 11 may be aheight in a Z direction orthogonal to X and Y directions. Here, the Xdirection may be a first direction, the Y direction may be a seconddirection orthogonal to the X direction, and the Z direction may be athird direction orthogonal to the X and Y directions. The substrate 11may be a flexible material, and the upper surface or a lower surface ofthe substrate 11 may include a curved surface.

The substrate 11 may include a wiring layer (not shown) at an upperportion thereof, and the wiring layer may be electrically connected tothe light emitting device 21. The reflection member or a protectionlayer disposed on the upper portion of the substrate 11 may protect thewiring layer. The plurality of light emitting devices 21 may beconnected in series, in parallel, or in series-parallel by the wiringlayer of the substrate 11. Groups having two or more of the plurality oflight emitting devices 21 may be connected in series or in parallel, orthe groups therebetween may be connected in series or in parallel.

As shown in FIG. 2, a length x1 in the X direction of the substrate 11and a length y1 in the Y direction may be different from each other, andfor example, the length x1 in the X direction may be disposed to belonger than the length y1 in the Y direction. The length x1 in the Xdirection may be disposed to be two times or more the length y1 in the Ydirection. The thickness of the substrate 11 may be 0.5 mm or less, forexample, in a range of 0.3 to 0.5 mm. Since the thickness of thesubstrate 11 is provided to be thin, a thickness of the lighting modulemay not be increased. Since the substrate 11 is provided with athickness of 0.5 mm or less, a flexible module may be supported. Thethickness of the substrate 11 may be 0.1 times or less, or may be in arange of 0.1 to 0.06 times a distance from the lower surface of thesubstrate 11 to the upper surface of the uppermost layer thereof. Thedistance from the lower surface of the substrate 11 to the upper surfaceof the uppermost layer 51 thereof may be a thickness of the lightingmodule.

The thickness of the lighting module 100 may be ⅓ or less of a shorterlength of the lengths x1 and y1 in the X and Y directions of thesubstrate 11, but is not limited thereto. The thickness of the lightingmodule 100 may be 5.5 mm or less at a bottom of the substrate 11, in therange of 4.5 to 5.5 mm, or in the range of 4.5 to 5 mm. The thickness ofthe lighting module 100 may be a straight-line distance between thelower surface of the substrate 11 and upper surfaces of the upper layers41 and 51. The thickness of the lighting module 100 may be 220% or less,for example, in a range of 180 to 220% of a thickness of the first resinlayer 31. The thickness of the lighting module 100 may be a distancefrom the lower surface of the substrate to the upper surface of theuppermost layer thereof, and may be 2.2 times or less, for example, inthe range of 1.8 to 2.2 times the thickness of the first resin layer 31.Since the lighting module 100 is provided with a thickness of 5.5 mm orless, it may be provided as a flexible and slim surface light sourcemodule.

When the thickness of the lighting module 100 is thinner than that ofthe above-described range, a light diffusion space may be reduced andhot spots may be generated, and when the thickness thereof is largerthan that of the above-described range, spatial installation may beconstrained and design freedom may be deteriorated due to an increase inmodule thickness. Since an embodiment provides a thickness of thelighting module 100 of 5.5 mm or less or 5 mm or less to provide amodule with a curved structure, design freedom and spatial constraintsmay be reduced. A ratio of the length y1 in the Y direction of thelighting module 100 to the thickness of the lighting module 100 may be1:m, a ratio relation may be m≤1, the m is a natural number of at least1 or more, the rows of the light emitting devices 21 may be an integersmaller than m. For example, when the m is equal to or greater than fourtimes the thickness of the lighting module 100, the light emittingdevice 21 may be arranged in four rows.

The substrate 11 may be provided with a connector 14 at a part thereofto supply power to the light emitting devices 21. In the substrate 11, aregion 13 in which the connector 14 is disposed is a region in which thefirst resin layer is not formed and may be equal to or smaller than thelength y1 of the substrate 11 in the Y direction. The connector 14 maybe disposed at a part of the upper surface or the lower surface of thesubstrate 11. When the connector 14 is disposed at the lower surface ofthe substrate 11, the region may be removed. The top view shape of thesubstrate 11 may have a rectangular shape, a square shape, anotherpolygonal shape, or a bar shape having a curved shape. The connector 14may be a terminal connected to the light emitting device 21, a femaleconnector, or a male connector.

The substrate 11 may include a protection layer or a reflection layer atthe upper portion. The protection layer or the reflection layer mayinclude a member having a solder resist material, and the solder resistmaterial is a white material, and may reflect incident light.

As another example, the substrate 11 may include a transparent material.Since the substrate 11 of the transparent material is provided, thelight emitted from the light emitting device 21 may be emitted indirections of the upper and lower surfaces of the substrate 11.

The light emitting device 21 is disposed on the substrate 11 and may besealed by the first resin layer 31. The plurality of light emittingdevices 21 may be in contact with the first resin layer 31. The firstresin layer 31 may be disposed on a side surface and an upper surface ofthe light emitting device 21. The first resin layer 31 may protect thelight emitting devices 21 and may be in contact with the upper surfaceof the substrate 11.

The light emitted from the light emitting device 21 may be emitted viathe first resin layer 31. The light emitting device 21 has an uppersurface S1 and a plurality of side surfaces S2, and the upper surface S1faces the upper surfaces of the upper layers 41 and 51 and emits lighttoward the upper layers 41 and 51. The upper surface S1 is a light exitsurface of the light emitting device 21, and most of light is emitted.The plurality of side surfaces S2 include at least four side surfaces,and light is emitted in a side direction of the light emitting device21. The light emitting device 21 is an LED chip emitting at least fivesurfaces, and may be disposed on the substrate 11 in a flip chip type.The light emitting device 21 may have a thickness of 0.3 mm or less. Asanother example, the light emitting device 21 may be implemented as ahorizontal chip or a vertical chip. In the case of the horizontal chipor the vertical chip, the light emitting device 21 may be connected toanother chip or wiring pattern by a wire. When a wire is connected tothe LED chip, a thickness of a diffusion layer may be increased due to aheight of the wire, and an interval between the light emitting devices21 may be increased due to a connection space according to a length ofthe wire. The light emitting device 21 according to an embodiment emitslight with five surfaces, and a beam spread angle distribution maybecome large. The light emitting device 21 may be disposed on thesubstrate 11 as a flip chip. An interval a between the light emittingdevices 21 may be equal to or greater than a thickness b (b≥a) of thefirst resin layer 31. The interval a may be 2.5 mm or more, for example,and may be varied depending on an LED chip size. A minimum intervalbetween the light emitting devices 21 may be equal to or greater than anindividual thickness of the first resin layer 31.

Since the light emitting device 21 disclosed in an embodiment isprovided as a flip chip emitting at least five surfaces, the luminancedistribution and the beam spread angle distribution of the lightemitting device 21 may be improved. As shown in FIG. 33, the luminancedistribution of the light emitting device disclosed in an embodiment mayhave a uniform luminance distribution of a predetermined level or morein an entire region, as shown in (b) of FIG. 33. However, in the case ofthe vertical chip of Comparative Example, it can be seen that darkportions are generated in a region between the light emitting devices asshown in (a) of FIG. 33. It can be seen that even when the intervalbetween the light emitting devices is further enlarged, the lightingmodule of an embodiment does not generate dark portions. In addition, asshown in FIG. 34, it can be seen that the beam spread angle distributionof the light emitting device of Comparative Example (a) is 120 degreesor less, and the beam spread angle distribution of the light emittingdevice of the embodiment (b) is 130 degrees or more. That is, thedistribution of the beam spread angle is distributed more widely, sothat the light diffusion effect may be given, the occurrence of darkportions may be reduced, and the interval between the light emittingdevices may be increased.

When the light emitting devices 21 are arranged on the substrate 11 inan N×M matrix, N may be one column or two or more columns, and M may beone row or two or more rows. The N and M are integers of 1 or more. Thelight emitting devices 21 may be arranged in the Y-axis direction andthe X-axis direction, respectively.

The light emitting device 21 is a light emitting diode (LED) chipcapable of emitting at least one of blue, red, green, ultraviolet (UV),and infrared rays. The light emitting device 21 may emit at least one ofblue, red, and green. The light emitting device 21 may be electricallyconnected to the substrate 11, but is not limited thereto.

The light emitting device 21 may be sealed with a transparent insulatinglayer or resin at a surface thereof, but is not limited thereto. Thelight emitting device 21 may include a phosphor layer having a phosphorat the surface.

The light emitting device 21 may include a support member having aceramic support member or a metal plate at a lower portion thereof, andthe support member may be used as an electrically conductive and heatconductive member.

The lighting module according to an embodiment may include a pluralityof resin layers on the light emitting device 21 and the substrate 11.The plurality of resin layers may include, for example, two or morelayers or three or more layers. The plurality of resin layers mayoptionally include at least two or more layers of a layer without animpurity, a layer to which a phosphor is added, a layer having adiffusing agent, and a layer to which a phosphor/diffusing agent isadded. At least one of the plurality of resin layers may optionallyinclude at least one of a diffusing agent, a phosphor, and inkparticles. That is, the phosphor and the diffusing agent may be added toseparate resin layers, or may be mixed with each other and disposed atone resin layer. The impurities may include a phosphor, a diffusingagent, or ink particles. The layers in which each of the phosphor andthe diffusing agent are included may be disposed to be adjacent to eachother or disposed to be spaced apart from each other. When the layers atwhich the phosphor and the diffusing agent are arranged are separatedfrom each other, the layer at which the phosphor is disposed may bedisposed above the layer at which the diffusing agent is disposed. Thephosphor and the ink particles may be disposed at the same layer or atdifferent layers from each other. For example, the layer to which theink particles are added may be disposed more above the layer to whichthe phosphor is added.

The phosphor may include at least one of a blue phosphor, a greenphosphor, a red phosphor, an amber phosphor, and a yellow phosphor. Asize of the phosphor may be in a range of 1 to 100 μm. For example, whenthe phosphor emits red light, the red wavelength may include a range of625 to 740 nm. The light emitting device 21 may emit blue light in arange of 400 to 500 nm, for example, 420 to 470 nm. The higher thedensity of the phosphor is, the higher the wavelength-conversionefficiency may be, but the luminous intensity may be deteriorated.Therefore, the phosphor may be added in consideration of the lightefficiency within the size. The diffusing agent may include at least oneof polymethyl methacrylate (PMMA) series, TiO₂, SiO₂, Al₂O₃, and siliconseries. The diffusing agent has a refractive index in a range of 1.4 to2 at the light emission wavelength, and a size thereof may be in a rangeof 1 to 100 μm. The diffusing agent may be spherical, but is not limitedthereto. As shown in FIG. 29, when the refractive index of the diffusingagent is 1.4 or more, the uniformity of light may be 90% or more. Asshown in FIG. 30, when the size of the diffusing agent is in the rangeof 1 to 30 μm, the uniformity of light may be 90% or more. The lightuniformity may be provided at 90% or more as the light uniformity on aregion in which the light emitting devices are connected to each other.

The ink particles may include at least one of metal ink, UV ink, andcuring ink. A size of the ink particles may be smaller than that of thephosphor. A surface color of the ink particles may be one of green, red,yellow, and blue. A type of the ink may be selectively applied amongpolyvinyl chloride (PVC) ink, polycarbonate (PC) ink, acrylonitrilebutadiene styrene (ABS) copolymer ink, UV resin ink, epoxy ink, siliconeink, polypropylene (PP) ink, PMMA ink, and polystyrene (PS) ink. Here, awidth or diameter of the ink particles may be in a range of 5 μm orless, for example, 0.05 to 1 μm. At least one of the ink particles maybe smaller than the wavelength of light. The material of the inkparticles may include at least one color of red, green, yellow, andblue. For example, the phosphor emits a red wavelength, and the inkparticles may include red. For example, the red color tone of the inkparticles may be darker than the color tone of the wavelength of thephosphor or light. The ink particles may be a different color from thecolor of the light emitted from the light emitting device. The inkparticles may give an effect of shielding or blocking incident light.

The resin layer may include a resin or may include a resin-basedmaterial. The plurality of resin layers may have the same refractionindex, at least two layers may have the same refraction index, or therefractive index of the layer adjacent to an uppermost layer may begradually lower or higher.

Referring to FIG. 1, the lighting module 100 may include at least oneupper layer on the first resin layer 31. The upper layer may include afirst diffusion layer 41 disposed on the first resin layer 31 and asecond diffusion layer 51 disposed on the first diffusion layer 41. Thefirst and second diffusion layers 41 and 51 may be a resin layerdisposed at an upper portion of the first resin layer 31. Alternatively,the first diffusion layer 41 may be defined as a second resin layerdisposed on the first resin layer, and the second diffusion layer 51 maybe defined as a third resin layer disposed on the second resin layer.

The first resin layer 31 is disposed on the substrate 11 to seal thelight emitting device 21. The first resin layer 31 may be thicker thanthe light emitting device 21. The first resin layer 31 may be a resinmaterial such as a transparent resin material, for example, anultraviolet (UV) resin, silicone or epoxy. The first resin layer 31 maybe a layer without a diffusing agent or a transparent molding layer.

The thickness b of the first resin layer 31 may be greater than that ofthe substrate 11. The thickness b of the first resin layer 31 may be ina range of 5 times or more, for example, 5 to 9 times the thickness ofthe substrate 11. The first resin layer 31 may be arranged in thethickness, so that the light emitting device 21 may be sealed on thesubstrate 11 to prevent moisture penetration, and the substrate 11 maybe supported. The first resin layer 31 and the substrate 11 may be aflexible plate. The thickness b of the first resin layer 31 may be in arange of 2.7 mm or less, for example, 2 to 2.7 mm. When the thickness bof the first resin layer 31 is smaller than the range, the intervalbetween the light emitting device 21 and the first diffusion layer 41may be reduced or the thickness of the layer for diffusion may beincreased, and when the thickness b of the first resin layer 31 islarger than the range, the thickness of the module may be increased orluminous intensity may be deteriorated.

The first resin layer 31 is disposed between the substrate 11 and thefirst diffusion layer 41 and guide the light emitted from the lightemitting device 21 to be emitted to the first diffusion layer 41. Thefirst resin layer 31 may be a layer of a transparent material to whichno impurities are added. Since the first resin layer has no impurities,the light may be transmitted with straightness.

The light emitted from the light emitting device 21 is emitted via theupper surface S1 and the side surface S2, and the light emitted via theupper surface S1 and the side surface S2 may be propagated via the firstresin layer 31. The light emitted through the side surface S2 orreflected in the first and second diffusion layers 41 and 51 may bereflected again at the upper surface of the substrate 11. The lightemitting device 21 may emit, for example, blue light in a range of 420to 470 nm.

The first diffusion layer 41 may be contacted on the first resin layer31. The first diffusion layer 41 may be formed of a resin materialhaving a diffusing agent after the first resin layer 31 is cured, andthen cured. Here, the diffusing agent may be added in a range of 1.5 to2.5 wt % based on the amount of the first diffusion layer 41 in theprocess. The first diffusion layer 41 may be a transparent resinmaterial, for example, an ultraviolet (UV) resin, epoxy or silicone. Therefractive index of the first diffusion layer 41 may be 1.8 or less, forexample, 1.1 to 1.8, or 1.4 to 1.6, and may be lower than the refractiveindex of the diffusing agent.

The UV resin, for example, may use as a main material a resin (oligomertype) having urethane acrylate oligomer as a main raw material. Forexample, urethane acrylate oligomer, which is a synthetic oligomer, maybe used. The main material may further include a monomer in whichisobornyl acrylate (IBOA), hydroxybutyl acrylate (HBA), and hydroxymetaethyl acrylate (HEMA), which are low boiling point diluent typereactive monomers, are mixed, and as an additive, a photoinitiator (forexample, 1-hydroxycyclohexyl phenyl-ketone, Diphenyl), Diphenyl(2,4,6-trimethylbenzoyl phosphine oxide), an antioxidant or the like maybe mixed. The UV resin may be formed of a composition including 10 to21% of an oligomer, 30 to 63% of a monomer, and 1.5 to 6% of anadditive. In this case, the monomer may be a mixture of 10 to 21% ofisobornyl acrylate (IBOA), 10 to 21% of hydroxybutyl acrylate (HBA), and10 to 21% of hydroxy metaethyl acrylate (HEMA). The additive may beadded in an amount of 1 to 5% of a photoinitiator to be able to performa function of initiating photoreactivity, and may be formed of a mixturecapable of improving yellowing by adding 0.5 to 1% of an antioxidant.The formation of the resin layer using the above-described compositionmay form a layer with a resin such as UV resin instead of a light guideplate to adjust the refractive index and the thickness, andsimultaneously, may satisfy all of adhesive characteristics, reliabilityand a mass production rate by using the above-described composition.

The first resin layer 31 and the first diffusion layer 41 may be formedof the same resin material. When the first resin layer 31 and the firstdiffusion layer 41 are the same resin material, the first resin layer 31and the first diffusion layer 41 are in close contact with each otherand light loss at an interface between the first resin layer 31 and thefirst diffusion layer 41 may be reduced. As shown in FIG. 27, when therefractive index of the resin material of the first resin layer 31 andthe first diffusion layer 41 is 1.4 or more at the light emissionwavelength, it can be seen that the uniformity of light is 90% or more.The refractive index of such a resin material may be in a range of 1.8or less, for example, 1.1 to 1.8, or 1.4 to 1.6, and may be lower thanthe refractive index of the diffusing agent. As shown in FIG. 28, whenthe refractive index of the resin material of the first resin layer 31and the first diffusion layer 41 is in the range of 1.1 to 1.8, it canbe seen that the light efficiency is 95% or more.

The first diffusion layer 41 may have a thickness (c, b>c) that isthinner than the thickness b of the first resin layer 31. The thicknessc of the first diffusion layer 41 may be 80% or less, for example, 40 to80% of the thickness b of the first resin layer 31. Since the firstdiffusion layer 41 is provided in a thin thickness, ductilitycharacteristics of the lighting module may be secured.

The first diffusion layer 41 may include a diffusing agent (beads or adispersing agent). The first diffusion layer 41 may be disposed betweenthe first resin layer 31 and the second diffusion layer 51. Thediffusing agent (beads or a dispersing agent) has a refractive index ina range of 1.4 to 2 at the light emission wavelength, and a size thereofmay be in a range of 4 to 6 μm. The diffusing agent may be spherical,but is not limited thereto. As shown in FIG. 29, when the refractiveindex of the diffusing agent is 1.4 or more, for example, 1.4 to 2, theuniformity of light may be 90% or more. As shown in FIG. 30, when thesize of the diffusing agent is in the range of 4 to 6 μm, the uniformityof light may be 90% or more.

The diffusing agent of the first diffusion layer 41 may diffuse lightincident via the first resin layer 31. Therefore, generation of hotspots due to light emitted via the first diffusion layer 41 may bereduced. The diffusing agent may have a size larger than the wavelengthof the light emitted from the light emitting device 21. Since thediffusing agent is disposed with a size larger than the wavelength, thelight diffusion effect may be improved.

A content of the diffusing agent may be in a range of 5 wt % or less,for example, 2 to 5 wt % in the first diffusion layer 41. When thecontent of the diffusing agent is smaller than the range, there is alimit to lowering hot spots. When the content is larger than the range,light transmittance may be deteriorated. Therefore, the diffusing agentis disposed in the first diffusion layer 41 in the above-describedcontent, and thus light may be diffused to reduce hot spots withoutdeteriorating the light transmittance.

The second diffusion layer 51 may be formed of a different material fromthe resin material of the first resin layer 31 and the first diffusionlayer 41. The second diffusion layer 51 may be a transparent layer, andmay include a phosphor therein. The second diffusion layer 51 mayinclude at least one of one or more types of phosphors such as a redphosphor, an amber phosphor or a yellow phosphor. Thewavelength-conversion efficiency of the diffused light may be increasedby adding a phosphor in the second diffusion layer 51. The seconddiffusion layer 51 may include a material such as silicone or epoxy. Therefractive index of the second diffusion layer 51 may be in a range from1.45 to 1.6. The refractive index of the second diffusion layer 51 maybe equal to or higher than that of the diffusing agent. The refractiveindex of the second diffusion layer 51 may be higher than that of thefirst resin layer 31 and the first diffusion layer 41. When therefractive index of the second diffusion layer 51 is lower than therange, the uniformity of light is lowered, and when the refractive indexis higher than the range, the light transmittance may be deteriorated.Accordingly, the refractive index of the second diffusion layer 51 maybe provided in the range to adjust the light transmittance and the lightuniformity. The second diffusion layer 51 may be defined as a layer fordiffusing light having a phosphor therein. The surface color of thesecond diffusion layer 51 may be a red color series or the same seriesas the phosphor. The surface color of the second diffusion layer 51indicates a color tone in a state in which the light emitting device isturned off. As another example, the surface color of the seconddiffusion layer 51 may be a different color from the phosphor.

A content of the phosphor may be added in the same amount as the resinmaterial constituting the second diffusion layer 51. A ratio of thephosphor to the resin material of the second diffusion layer 51 may be40% to 60% relative to 60% to 40%. For example, the resin material ofthe third phosphor and the second diffusion layer 51 may be added in thesame ratio, for example, may be mixed at 50% to 50%. As another example,a content of the phosphor may be in a range of 40 to 60 wt %, and acontent of the resin material of the second diffusion layer 51 may be ina range of 40 to 60 wt %. The content of the phosphor may have adifference of 20% or less or 10% or less from the ratio to the resinmaterial of the second diffusion layer 51. Here, as shown in (a) and (b)of FIG. 31, the amount of phosphor required for color coordinates Cx andCy decreases as the density of the diffusing agent (beads) added to thefirst diffusion layer increases. Accordingly, it can be seen that theamount of phosphor is adjusted according to the degree of diffusion oflight by the diffusing agent.

In the embodiment, the content of the phosphor in the second diffusionlayer 51 is added at 40 wt % or more, or 40 to 60 wt %, so that thecolor tone at a surface of the second diffusion layer 51 may be providedwith the color tone of the phosphor, and thus the diffusion andwavelength-conversion efficiency of light can be improved. In addition,it is possible to reduce the transmission of the wavelength, forexample, the blue light, of the light emitted from the light emittingdevice 21 via the second diffusion layer 51. Further, the lightextracted via the second diffusion layer 51 may be provided as a surfacelight source by the wavelength of the phosphor. For example, when thephosphor emits red light, the red wavelength may include a range of 625to 740 nm.

The second diffusion layer 51 may be provided in the form of a film, forexample, by adding a phosphor in a resin material and curing thephosphor. The second diffusion layer 51 may be directly formed on thefirst diffusion layer 41, or separately formed and then bonded. Thesecond diffusion layer 51 formed in the film form may be adhered to anupper surface of the first diffusion layer 41. An adhesive may bedisposed between the second diffusion layer 51 and the first diffusionlayer 41.

The adhesive may be, as a transparent material, an adhesive such as UVadhesive, silicone or epoxy. The second diffusion layer 51 may beprovided in the form of a film, so that it is possible to uniformlyprovide the phosphor distribution therein and to provide the color toneof the surface color at a predetermined level or more.

A resin material film may be used as the second diffusion layer 51, sothat a module with high ductility may be provided, as compared with thecase of using a polyester (PET) film. The second diffusion layer 51 maybe a protection film having a phosphor or a release film having aphosphor. The second diffusion layer 51 may be provided as a filmattachable to or detachable from the first diffusion layer 41.

The second diffusion layer 51 may have a thickness (d, d<c<b) smallerthan the thickness c of the first diffusion layer 41 and for example,may be in a range from 0.3 to 0.5 mm. The thickness d of the seconddiffusion layer 51 may be in a range of 25% or less, for example, 16% to25% of the thickness c of the first diffusion layer 41. The thickness dof the second diffusion layer 51 may be in a range of 18% or less, forexample, 14% to 18% of the thickness b of the first resin layer 31. Whenthe thickness d of the second diffusion layer 51 is larger than therange, the light extraction efficiency may be decreased or the modulethickness may be increased, and when the thickness d of the seconddiffusion layer 51 is smaller than the range, the suppressing of hotspots may be difficult, or the wavelength-conversion efficiency may belowered. Furthermore, the second diffusion layer 51 is a layer forwavelength conversion and external protection, and when the seconddiffusion layer 51 is thicker than the range, the ductilitycharacteristics of the module may be deteriorated and the degree ofdesign freedom may be lowered.

The phosphor converts the light emitted from the light emitting device21 to a wavelength. The phosphor may emit light having a longerwavelength than that of the light emitted from the light emitting device21. When the phosphor is a red phosphor, an incident light is convertedinto red light. Most of the light emitted from the light emitting device21 may be wavelength-converted. The light is uniformly diffused via thediffusing agent added to the first diffusion layer 41 and the diffusedlight may be wavelength-converted by the phosphor added to the seconddiffusion layer 51. As another example, the phosphor may include forexample, at least one or two or more of an amber phosphor, a yellowphosphor, a green phosphor, a red phosphor, and a blue phosphor.

Since the second diffusion layer 51 includes a phosphor, the appearancecolor may be shown as the color of the phosphor. For example, when thephosphor is red, the surface color of the second diffusion layer 51 maybe seen in red. The surface of the second diffusion layer 51 or thesurface of the lighting module may be provided as a red image when thelight emitting device 21 is turned off, and when the light emittingdevice 21 is turned on, red light having a certain luminous intensitymay be diffused and provided as a red image of the surface light source.The color coordinates of the surface color may have different valueswithin the color of the phosphor depending on whether the light emittingdevice 21 is turned on or off.

The lighting module 100 according to an embodiment may have a thicknessof 5.5 mm or less, may emit a surface light source via an upper surfaceand may have ductility characteristics. The lighting module 100 may emitlight via a side surface.

An embodiment may provide a flexible lighting module having a pluralityof resin layers, for example, a first resin layer 31, and diffusionlayers 41 and 51, on a substrate 11. The lighting module of anembodiment allows light to be guided in a radial or straight directionin the first resin layer 31 to diffuse, to be diffused via the diffusingagent of the first diffusion layer 41, and to be wavelength-convertedand diffused via the phosphor of the second diffusion layer 51.Accordingly, the light to be finally emitted via the lighting module isemitted as a surface light source. In addition, the plurality of lightemitting devices 21 in the lighting module 100 may emit light at fivesurfaces thereof on a flexible substrate in a flip manner, and the lightemitted via the upper and side surfaces of the light emitting device 21may be emitted in a direction of the first and second diffusion layers41 and 51 and in a direction of a side of the first resin layer 31. Thelight emitted from the light emitting device 21 may emit light indirections of an upper surface and all side surfaces of the lightingmodule. The above-described lighting module may be applied to a lamp ofa vehicle, a display device having a micro LED, or various lightingapparatuses. The first resin layer 31 may have a polygonal shape or acurved shape.

The above-described lighting module has a surface color and provides asurface light source, so that an additional inner lens may be removed,and an air gap on the light emitting device 21 or a structure forinserting the light emitting device 21 may be removed by sealing thelight emitting devices 21 with the first resin layer 31.

The lighting module 100 may be provided in a flat plate shape, a convexcurved shape, a concave curved shape, or a convex-concave shape whenviewed from the side. The lighting module may be a bar shape like astripe, a polygonal shape, a circular shape, an elliptical shape, ashape having a convex side surface, or a shape having a concave sidesurface when viewed from the top view.

FIGS. 3 to 13 are modified examples of the diffusion layer or anotherstructure in the lighting module of the invention, and the sameconfiguration as the above-described configuration is referred to theabove description, and may be selectively applied to the modifiedexample or another example.

FIG. 3 is a first modified example of the lighting module of FIG. 1.

Referring to FIG. 3, a plurality of light emitting devices 21 may bedisposed on a substrate 11, and a first resin layer 32 may be disposedon the plurality of light emitting devices 21. The lighting module is aconfiguration in which two layers are removed from the lighting moduledescribed in FIG. 1.

The first resin layer 32 may include a phosphor and a diffusing agent.The phosphor may include at least one of a red phosphor, an amberphosphor, a yellow phosphor, a green phosphor, and a white phosphor. Thefirst resin layer 32 may be defined as a diffusion layer or a resinlayer. The first resin layer 32 may be formed of the same material asthat of the first resin layer disclosed in FIG. 1.

A content of the diffusing agent added to the first resin layer 32 maybe in a range of 5 wt % or less, for example, 2 to 5 wt %. When thecontent of the diffusing agent is smaller than the range, there is alimit to lowering hot spots. When the content is larger than the range,the light transmittance may be deteriorated. Therefore, the diffusingagent is disposed in the first resin layer 32 in the above-describedcontent, and thus light may be diffused to reduce hot spots withoutdeteriorating the light transmittance.

The phosphor added in the first resin layer 32 may have a difference incontent with the resin material of the first resin layer 32 by 25% orless or 15% or less. The content of the phosphor may be added to thefirst resin layer 32 in the range of 35 wt % or more, or 35 to 45 wt %.The content of the phosphor in the first resin layer 32 may be 5 timesor more than a content the diffusing agent. Accordingly, the color at asurface of the first resin layer 32 may be provided with the color toneof the phosphor, and the diffusion and wavelength-conversion efficiencyof light may be improved. In addition, it is possible to reduce thetransmission of the wavelength, for example, the blue light, of lightemitted from the light emitting device 21 via the first resin layer 32.Further, the light extracted via the first resin layer 32 may beprovided as a surface light source by the wavelength of the phosphor. Athickness of the first resin layer 32 may be formed in a range of 3 mmor more, for example, 3 to 5 mm. The first resin layer 32 is provided inthe range of thickness, so that light may be diffused andwavelength-converted. Such a lighting module may be provided as asurface light source. The thickness of the first resin layer 32 may beequal to or less than the interval between the light emitting devices21. Alternatively, the interval between the plurality of light emittingdevices 21 may be equal to or greater than the thickness of the firstresin layer 32.

The lighting module of FIG. 3 has a structure in which the first andsecond diffusion layers are removed in FIG. 1, and may provide awavelength-converted surface light source by using the thickness of thefirst resin layer 32. The first resin layer 32 may include the functionof the first and second diffusion layers disclosed in FIG. 1. The firstresin layer 32 may be molded on the light emitting device 21 and cured.The lighting module according to an embodiment may have a thickness of5.5 mm or less, may emit a surface light source via an upper surface andmay have ductility characteristics. The lighting module may emit lightvia a side surface.

FIG. 4 is a second modified example of the lighting module of FIG. 1.

Referring to FIG. 4, a plurality of light emitting devices 21 arearranged on a substrate 11, the plurality of light emitting devices 21are molded with a first resin layer 33, a first diffusion layer 55 maybe disposed on the first resin layer 33. The lighting module is aconfiguration in which one layer is removed from the lighting moduledescribed in FIG. 1.

The first resin layer 33 may mold the light emitting device 21. Thefirst resin layer 33 may be formed of a resin material having adiffusing agent, and then cured. Here, a content of the diffusing agentmay be added in a range of 1.5 to 2.5 wt % based on the amount of thefirst resin layer 33 in the process. The first resin layer 33 may beformed of a transparent resin material, for example, an ultraviolet (UV)resin, epoxy or silicone. The first diffusion layer 55 and the firstresin layer 33 may be the same resin material. The lighting module mayprovide a thin module thickness by removing a part of the layers of FIG.1, and may diffuse light via the first resin layer 33 to reduce hotspots. The first resin layer 33 may include the function of a layerhaving a diffusing agent in FIG. 1.

A thickness of the first resin layer 33 may be formed in a range of 3 mmor more, for example, 3 to 4 mm, so that the deterioration in lightdiffusion may be prevented. The first resin layer 33 may include adiffusing agent (beads or a dispersing agent). The first resin layer 33may be disposed between the substrate 11 and the first diffusion layer55. The first resin layer 33 may diffuse the light emitted via the lightemitting device 21. Therefore, generation of hot spots due to lightemitted via the first resin layer 33 may be reduced. The diffusing agentmay have a size larger than the wavelength of the light emitted from thelight emitting device 21. Since such a diffusing agent is disposed witha size larger than the wavelength, the light diffusion effect may beimproved.

A content of the diffusing agent may be in a range of 5 wt % or less,for example, 2 to 5 wt % in the first resin layer 33. When the contentof the diffusing agent is smaller than the range, there is a limit tolowering hot spots. When the content is larger than the range, the lighttransmittance may be deteriorated. Therefore, the diffusing agent isdisposed in the first resin layer 33 in the above-described content, andthus light may be diffused to reduce hot spots without deteriorating thelight transmittance.

The first diffusion layer 55 may include a phosphor, and the phosphormay include, for example, at least one of a red phosphor, an amberphosphor, a yellow phosphor, a green phosphor, and a white phosphor. Thephosphor added in the first diffusion layer 55 may have a difference incontent with the resin material of the first diffusion layer 55 by 20%or less or 10% or less. A content of the phosphor may be added to thefirst diffusion layer 55 in a range of 40 wt % or more or 40 to 60 wt %.Accordingly, the color at a surface of the first diffusion layer 55 maybe provided in the color tone of the phosphor, and the diffusion andwavelength-conversion efficiency of light may be improved. In addition,it is possible to reduce the transmission of the wavelength, forexample, the blue light, of light emitted from the light emitting device21 via the first diffusion layer 55. Further, the light extracted viathe first diffusion layer 55 may be provided as a surface light sourceby the wavelength of the phosphor. A thickness of the first diffusionlayer 55 may be formed in a range of 0.3 mm or more, for example, 0.3 to0.7 mm. The light may be diffused and wavelength-converted by providingthe first diffusion layer 55 with the thickness in the range. Such alighting module may be provided as a surface light source. The lightingmodule according to an embodiment may have a thickness of 5.5 mm orless, may emit a surface light source via an upper surface and may haveductility characteristics. The lighting module may emit light via a sidesurface.

FIG. 5 is another example of the lighting module of FIG. 4. Referring toFIG. 5, in the lighting module, a first diffusion layer 55 may bedisposed on a first resin layer 33 covering the light emitting device 21disclosed in an embodiment, and the first diffusion layer 55 may includea side portion 55 a covering a side surface of the first resin layer 33.The side portion 55 a of the first diffusion layer 55 is disposed alongthe side surface of the first resin layer 33 and covers the side surfaceof the first resin layer 33. The side portion 55 a may be extended froman edge of an upper surface of the first resin layer 33 in the directionof the upper surface of the substrate 11. The side portion 55 a of thefirst diffusion layer 55 may be in contact with the upper surface of thesubstrate 11. The side portion 55 a of the first diffusion layer 55 iscontacted along the outer circumference of the substrate 11, so thatmoisture penetration may be prevented and the side surface of thelighting module may be protected. The above-described phosphors may beadded to the side portion 55 a of the first diffusion layer 55, but theinvention is not limited thereto. The side portion 55 a of the firstdiffusion layer 55 may be formed at one side surface, at least two sidesurfaces or all side surfaces of the first resin layer 33 or may open atleast one side surface. Some light may be extracted via the openedregion.

FIG. 6 is a third modified example of the lighting module of FIG. 1.

Referring to FIG. 6, a plurality of light emitting devices 21 may bedisposed on a substrate 11, the plurality of light emitting devices 21may be molded with a first resin layer 33, and a first diffusion layer52 may be disposed on the first resin layer 33. The lighting module is aconfiguration in which one layer is removed from the lighting moduledescribed in FIG. 1.

The first resin layer 33 may mold the light emitting device 21. Thefirst resin layer 33 may be formed of a resin material having adiffusing agent, and then cured. Here, a content of the diffusing agentmay be added in a range of 1.5 to 2.5 wt % based on the amount of thefirst resin layer 33 in the process. The first resin layer 33 may be atransparent resin material, for example, an ultraviolet (UV) resin,epoxy or silicone. The lighting module may provide a thin modulethickness by removing one layer from the module of FIG. 1 and diffuselight via the first resin layer 33 to reduce hot spots.

A thickness of the first resin layer 33 is formed in a range of 3 mm ormore, for example, 3 to 4 mm, so that a deterioration in light diffusionmay be prevented. The first resin layer 33 may include a diffusing agent(beads or a dispersing agent). The first resin layer 33 may be disposedbetween the substrate 11 and the first diffusion layer 52. The firstresin layer 33 may diffuse the light emitted via the light emittingdevice 21. Therefore, generation of hot spots due to light emitted viathe first resin layer 33 may be reduced. The diffusing agent may have asize larger than the wavelength of the light emitted from the lightemitting device 21. Since such a diffusing agent is disposed with a sizelarger than the wavelength, the light diffusion effect may be improved.

A content of the diffusing agent may be in a range of 5 wt % or less,for example, 2 to 5 wt % in the first resin layer 33. When the contentof the diffusing agent is smaller than the range, there is a limit tolowering hot spots. When the content is larger than the range, the lighttransmittance may be deteriorated. Therefore, the diffusing agent isdisposed in the first resin layer 33 in the above-described content, andthus light may be diffused to reduce hot spots without deteriorating thelight transmittance.

The first diffusion layer 52 may include a phosphor and a diffusingagent, and the phosphor may include at least one of a red phosphor, anamber phosphor, a yellow phosphor, a green phosphor, and a whitephosphor. The diffusing agent may include at least one of polymethylmethacrylate (PMMA) series, TiO₂, SiO₂, Al₂O₃, and silicon series. Thediffusing agent may include a metal oxide. The diffusing agent has arefractive index in a range of 1.4 to 2 at the light emissionwavelength, and a size thereof may be in a range of 4 to 6 μm. Thediffusing agent may be spherical, but is not limited thereto. As shownin FIG. 29, when the refractive index of the diffusing agent is 1.4 ormore, for example, 1.4 to 2, the uniformity of light may be 90% or more.As shown in FIG. 30, when the size of the diffusing agent is in therange of 4 to 6 μm, the uniformity of light may be 90% or more. Thediffusing agent may be spherical, but is not limited thereto. A contentof the diffusing agent may be in a range of 5 wt % or less, for example,2 to 5 wt % in the first resin layer 33. When the content of thediffusing agent is smaller than the range, there is a limit to loweringhot spots. When the content is larger than the range, the lighttransmittance may be deteriorated. Therefore, the diffusing agent isdisposed in the first resin layer 33 in the above-described content, andthus light may be diffused to reduce hot spots without deteriorating thelight transmittance.

The phosphor added in the first diffusion layer 52 may have a differencein content with the resin material of the first diffusion layer 52 by35% or less or 25% or less. The content of the phosphor may be added tothe first diffusion layer 52 in a range of 35 wt % or more or 35 to 45wt %. The content of the phosphor in the first diffusion layer 52 may be5 times or more than a content of the diffusing agent. Accordingly, thecolor at a surface of the first diffusion layer 52 may be provided inthe color tone of the phosphor, and the diffusion andwavelength-conversion efficiency of light may be improved. In addition,it is possible to reduce the transmission of the wavelength, forexample, the blue light, of the light emitted from the light emittingdevice 21 via the first diffusion layer 52. Further, the light extractedvia the first diffusion layer 52 may be provided as a surface lightsource by the wavelength of the phosphor. A thickness of the firstdiffusion layer 52 may be formed in a range of 0.3 mm or more, forexample, 0.3 to 0.7 mm. The light may be diffused andwavelength-converted by providing the first diffusion layer 52 with thethickness in the range. Such a lighting module may be provided as asurface light source. The lighting module may be provided as a flexiblesurface light source module having a thin thickness.

FIG. 7 is another example of the lighting module of FIG. 6.

Referring to FIG. 7, in the lighting module, a first diffusion layer 52may be disposed on a first resin layer 33 covering the light emittingdevice 21 disclosed in an embodiment, and the first diffusion layer 52may include a side portion 52 a covering a side surface of the firstresin layer 33. The side portion 52 a of the first diffusion layer 52may cover along the side surface of the first resin layer 33 and may beextended in the direction of the upper surface of the substrate 11. Theside portion 52 a of the first diffusion layer 52 may be in contact withthe upper surface of the substrate 11. The side portion 52 a of thefirst diffusion layer 52 is contacted along the outer circumference ofthe substrate 11, so that moisture penetration may be prevented and theside surface of the lighting module may be protected. Theabove-described phosphor and diffusing agent may be added to the sideportion of the first diffusion layer 52, but is not limited thereto. Theside portion 52 a of the first diffusion layer 52 may be formed at oneside surface, at least two side surfaces or all side surfaces of thefirst resin layer 33 or may open at least one side surface. Some lightmay be extracted via the opened region.

FIG. 8 is a fourth modified example of the lighting module of FIG. 1.The fourth modified example is an example modified from the structure ofFIG. 1, and the following description will focus on an example differentfrom the description of FIG. 1.

Referring to FIG. 8, the lighting module may include a substrate 11, aplurality of light emitting devices 21 on the substrate 11, a firstresin layer 31 covering the light emitting devices 21, a first diffusionlayer 41 on the first resin layer 31 and a second diffusion layer 53 onthe first diffusion layer 41. The configuration of the first and seconddiffusion layers will be described with reference to the description ofFIG. 1. The second diffusion layer 53 may be defined as a second resinlayer, a diffusion layer, or a phosphor layer.

The second diffusion layer 53 may include a phosphor and a diffusingagent, and the phosphor may include at least one of a red phosphor, anamber phosphor, a yellow phosphor, a green phosphor, and a whitephosphor. The diffusing agent may include at least one of polymethylmethacrylate (PMMA) series, TiO₂, SiO₂, Al₂O₃, and silicon series. Thediffusing agent has a refractive index in a range of 1.4 to 2 at thelight emission wavelength, and a size thereof may be in a range of 4 to6 μm. The diffusing agent may be spherical, but is not limited thereto.As shown in FIG. 29, when the refractive index of the diffusing agent is1.4 or more, for example, 1.4 to 2, the uniformity of light may be 90%or more, and as shown in FIG. 30, when the size of the diffusing agentis in the range of 4 to 6 μm, the uniformity of light may be 90% ormore.

The diffusing agent may be spherical, but is not limited thereto. Acontent of the diffusing agent may be in a range of 5 wt % or less, forexample, 2 to 5 wt % in the first diffusion layer 41. When the contentof the diffusing agent is smaller than the range, there is a limit tolowering hot spots. When the content is larger than the range, the lighttransmittance may be deteriorated. Therefore, the diffusing agent isdisposed in the first diffusion layer 41 in the above-described content,and thus light may be diffused to reduce hot spots without deterioratingthe light transmittance.

The phosphor added in the second diffusion layer 53 may have adifference in content with the resin material of the second diffusionlayer 53 by 35% or less or 25% or less. A content of the phosphor may beadded to the second diffusion layer 53 in a range of 35 wt % or more, or35 to 45 wt %. Accordingly, the color at a surface of the seconddiffusion layer 53 may be provided with a color tone of the phosphor,and the diffusion and wavelength-conversion efficiency of light may beimproved. In addition, it is possible to reduce the transmission of thewavelength, for example, the blue light, of light emitted from the lightemitting device 21 via the second diffusion layer 53. Further, the lightextracted via the second diffusion layer 53 may be provided as a surfacelight source by the wavelength of the phosphor. A thickness of thesecond diffusion layer 53 may be formed in a range of 0.3 mm or more,for example, 0.3 to 0.5 mm. The light may be diffused andwavelength-converted by providing the second diffusion layer 53 with thethickness in the range. Such a lighting module may be provided as asurface light source.

FIG. 9 is another example of the lighting module of FIG. 8, in which thefirst and second diffusion layers in the lighting module of FIG. 8 arethe same and further include a side portion 52 a of the second diffusionlayer 52. The second diffusion layer 52 may include a side portion 52 acovering side surfaces of the first resin layer 31 and the firstdiffusion layer 41. The side portion 52 a of the second diffusion layer52 may cover along the side surfaces of the first resin layer 31 and thefirst diffusion layer 41 and may be extended in the direction of theupper surface of the substrate 11. The side portion 52 a of the seconddiffusion layer 52 may be in contact with the upper surface of thesubstrate 11. The side portion 52 a of the second diffusion layer 52 iscontacted along the outer circumference of the substrate 11, so thatmoisture penetration may be prevented and the side surface of thelighting module may be protected. The above-described phosphor and thediffusing agent may be added to the side portion 52 a of the seconddiffusion layer 52. The side portion 52 a of the first diffusion layer52 may be formed at one side surface, at least two side surfaces or allside surfaces of the first resin layer 31 and the first diffusion layer41 or may open at least one side surface.

FIG. 10 is another example of the lighting module of FIG. 1, in whichthe first and second diffusion layers in the lighting module of FIG. 1are the same and further include a side portion 51 a of the seconddiffusion layer 51. The second diffusion layer 51 may include a sideportion 51 a covering side surfaces of the first resin layer 31 and thefirst diffusion layer 41. The side portion of the second diffusion layer51 may cover along the side surfaces of the first resin layer 31 and thefirst diffusion layer 41 and may be extended in the direction of theupper surface of the substrate 11. The side portion 51 a of the seconddiffusion layer 51 may be in contact with the upper surface of thesubstrate 11. The side portion 51 a of the second diffusion layer 51 iscontacted along the outer circumference of the substrate 11, so thatmoisture penetration may be prevented and the side surface of thelighting module may be protected. The above-described phosphor may beadded to the side portion 51 a of the second diffusion layer 51, but isnot limited thereto. The side portion 51 a of the second diffusion layer51 may be formed at one side surface, at least two side surfaces or allside surfaces of the first and second diffusion layers, or may open atleast one side surface.

FIG. 11 is a fifth modified example of the lighting module of FIG. 1.The fifth modified example is an example modified from the structure ofFIG. 1, and the following description will focus on an example differentfrom the description of FIG. 1.

Referring to FIG. 11, the lighting module may include a substrate 11, aplurality of light emitting devices 21 on the substrate 11, a firstresin layer 31 covering the light emitting devices 21, and a firstdiffusion layer 54 on the resin layer 31. The configuration of the firstresin layer 31 will be described with reference to FIG. 1, and theconfiguration of the first resin layer 31 is a configuration in whichone layer is removed from the lighting module of FIG. 1.

The first diffusion layer 54 may include a phosphor and a diffusingagent, and the phosphor may include, for example, at least one of a redphosphor, an amber phosphor or a yellow phosphor, a green phosphor, anda white phosphor. The diffusing agent may include at least one ofpolymethyl methacrylate (PMMA) series, TiO₂, SiO₂, Al₂O₃, and siliconseries. The diffusing agent has a refractive index in a range of 1.4 to2 at the light emission wavelength, and a size thereof may be in a rangeof 4 to 6 μm. The diffusing agent may be spherical, but is not limitedthereto. As shown in FIG. 29, when the refractive index of the diffusingagent is 1.4 or more, for example, 1.4 to 2, the uniformity of light maybe 90% or more. As shown in FIG. 30, when the size of the diffusingagent is in the range of 4 to 6 μm, the uniformity of light may be 90%or more. The diffusing agent may be spherical, but is not limitedthereto. A content of the diffusing agent may be in a range of 5 wt % orless, for example, 2 to 5 wt % in the first diffusion layer 54. When thecontent of the diffusing agent is smaller than the range, there is alimit to lowering hot spots. When the content is larger than the range,the light transmittance may be deteriorated. Therefore, the diffusingagent is disposed in the first diffusion layer 54 in the above-describedcontent, and thus light may be diffused to reduce hot spots withoutdeteriorating the light transmittance.

The phosphor added in the first diffusion layer 54 may have a differencein content with the resin material of the first diffusion layer 54 by35% or less or 25% or less. A content of the phosphor may be added tothe first diffusion layer 54 in a range of 35 wt % or more or 35 to 45wt %. The content of the phosphor in the first diffusion layer 54 may be5 times or more higher than that of the diffusing agent. Accordingly,the color at a surface of the first diffusion layer 54 may be providedin the color tone of the phosphor, and the diffusion andwavelength-conversion efficiency of light may be improved. In addition,it is possible to reduce the transmission of the wavelength, forexample, the blue light, of light emitted from the light emitting device21 via the first diffusion layer 54. Further, the light extracted viathe first diffusion layer 54 may be provided as a surface light sourceby the wavelength of the phosphor. A thickness of the first diffusionlayer 54 may be in a range of 1.7 mm or more, for example, 1.7 to 2.2mm. The light may be diffused and wavelength-converted by providing thefirst diffusion layer 54 with the thickness in the range. Such alighting module may be provided as a surface light source. The lightingmodule may be provided as a flexible surface light source module havinga thin thickness. The first diffusion layer 54 may be defined as a resinlayer, a diffusion layer, or a phosphor layer.

FIG. 12 is another example of the lighting module of FIG. 11. The firstresin layer 31 in the lighting module of FIG. 11 is the same, and a sideportion 54 a of a first diffusion layer 54 is further included. Thefirst diffusion layer 54 may include a side portion 54 a covering a sidesurface of the first resin layer 31. The side portion 54 a of the firstdiffusion layer 54 may cover along the side surface of the first resinlayer 31 and may be extended in the direction of the upper surface ofthe substrate 11. The side portion 54 a of the first diffusion layer 54may be in contact with the upper surface of the substrate 11. The sideportion 54 a of the first diffusion layer 54 is contacted along theouter circumference of the substrate 11, so that moisture penetrationmay be prevented and the side surface of the lighting module may beprotected. The above-described phosphor may be added to the side portion54 a of the first diffusion layer 54, but the invention is not limitedthereto. The side portion 54 a of the first diffusion layer 54 may beformed at one side surface, at least two side surfaces or all sidesurfaces of the first resin layer 31 or may open at least one sidesurface.

FIG. 13 is a sixth modified example of the lighting module of FIG. 1.FIG. 13 is a modified example between the first and second diffusionlayers in the lighting module of FIG. 1.

Referring to FIG. 13, the lighting module may include a substrate 11, alight emitting device 21 disposed on the substrate 11, a first resinlayer 31 on the substrate 11, an adhesive layer 45 and a light shieldingportion 46 on the first resin layer 31, a first diffusion layer 41 onthe adhesive layer 45 and the light shielding portion 46, and a seconddiffusion layer 51 on the first diffusion layer 41. In this lightingmodule, the first resin layer 31 and the first and second diffusionlayers 41 and 51 are the same as the configuration in FIG. 1, and aduplicate description thereof will be omitted.

The adhesive layer 45 may be adhered between the first resin layer 31and the first diffusion layer 41. The adhesive layer 45 may be the samematerial as that of the first resin layer 31 and the first diffusionlayer 41 or may be formed of a different material. The adhesive layer 45may be a resin material such as silicone or epoxy. The adhesive layer 45may be disposed at a circumference of the light shielding portion 46 ormay be extended to a lower surface of the light shielding portion 46.The light shielding portion 46 may be disposed at a lower surface of thefirst diffusion layer 41 at a region corresponding to the light emittingdevice 21. The light shielding portion 46 may be overlapped with thelight emitting device 21 in a vertical direction. The light shieldingportion 46 may be in a range of 50% or more, for example, 50% to 120% ofthe upper surface area of the light emitting device 21 on the lightemitting device 21. The light shielding portion 46 may be formed througha region in which a white material is printed. The light shieldingportion 46 may be printed by using, for example, a reflection inkincluding any one of TiO₂, Al₂O₃, CaCO₃, BaSO₄, and silicon. The lightshielding portion 46 may reflect light emitted via the light exitsurface of the light emitting device 21 to reduce the occurrence of hotspots due to the luminous intensity of light on the light emittingdevice 21. The light shielding portion 46 may print a light shieldingpattern by using light shielding ink. The light shielding portion 46 maybe formed to be printed at the lower surface of the first diffusionlayer 41. The light shielding portion 46 may not shield 100% of incidentlight, but transmittance may be lower than reflectance, so that thelight shielding portion 46 may perform a function of shielding anddiffusing the light. The light shielding portion 46 may be formed as asingle layer or multiple layers, and may have the same pattern shape ordifferent pattern shapes.

The second diffusion layer 51 may include the above-described sideportion to cover side surfaces of the first resin layer 31 and the firstdiffusion layer 41. As another example, the side portion may be formedby being extended by the first diffusion layer 41. As another example,although an example in which the side portion of the second diffusionlayer 51 is in contact with the upper surface of the substrate 11 hasbeen described, the side portion of the second diffusion layer 51 may bein contact with an upper surface of any one of the first resin layer 31and the first diffusion layer 41. As another example, the side portionof the second diffusion layer 51 may be in contact with at least one ofthe upper surfaces of the first resin layer 31 and the first diffusionlayer 41 and the upper surface of the substrate 11. In this case, theouter circumferences of the first resin layer 31 and the first diffusionlayer 41 may be formed in a concave-convex pattern.

The lighting module according to an embodiment may have the bestwavelength-conversion efficiency when a diffusion layer having aphosphor is disposed at the farthest position from the light emittingdevice. In such first to second diffusion layers, the order of thelayers may be stacked as described above or may be stacked differently.For example, the first diffusion layer having the diffusing agent may bedisposed adjacent to the light emitting device or further under thefirst resin layer. For example, the second diffusion layer having thephosphor may be disposed adjacent to the light emitting device orfurther under the first resin layer, but is not limited thereto. Thelighting module may be provided as a flexible surface light sourcemodule having a thin thickness.

The upper surface area of the substrate 11 disclosed in the firstembodiment may be equal to or greater than the lower surface area of theabove-described first resin layer. The length of the substrate 11 in thefirst and second directions X and Y may be greater than that of thefirst resin layer in the first and second directions. The outercircumference of the substrate 11 may be extended outward beyond theside surface of the first resin layer. The outer circumference of thesubstrate 11 may be extended further outward beyond the side portions ofthe first and second diffusion layers. The length of the substrate 11 inthe first and second directions may protrude in a range of 10% or less,or 1% to 10% from at least one of the side surface of the first resinlayer and the side portions of the first and second diffusion layers.

Embodiments of the invention can solve the problem that the material ofa diffusion plate such as a light guide plate is not flexible and thusis not suitable for a curved surface structure. In addition, the numberof light emitting devices may be reduced for a surface light source.

An embodiment may provide a flexible lighting module having a pluralityof resin layers, for example, a first resin layer 31, and diffusionlayers 41 and 51, on a substrate 11. A flexible lighting module havingsuch a laminated structure may be provided. The lighting module of anembodiment allows light to be guided in a radial or straight directionin the first resin layer 31 to diffuse, to be diffused via the diffusingagent of the first diffusion layer 41, and to be wavelength-convertedand diffused via the phosphor of the second diffusion layer 51.

Accordingly, the light to be finally emitted via the lighting module isemitted as the surface light source. In addition, the plurality of lightemitting devices 21 in the lighting module 100 may emit light at fivesurfaces thereof on the flexible substrate in a flip manner, and thelight emitted via the upper and side surfaces of the light emittingdevice 21 may be emitted in a direction of the first and seconddiffusion layers 41 and 51 and in a direction of a side of the firstresin layer 31.

Second Embodiment

In describing the second embodiment, redundant description of the sameconfiguration as that of the first embodiment will be omitted, and thesame configuration as that of the first embodiment will refer to thefirst embodiment. The lighting module according to the second embodimentmay include one or a plurality of resin layers on the light emittingdevice and the substrate. The resin layer may include, for example, oneor more layers or two or more layers. The resin layer may optionallyinclude at least two or three or more layers among an impurity-freelayer, a layer to which a phosphor has been added, a layer having adiffusing agent, a layer to which ink particles have been added, a layerto which a phosphor and a diffusing agent have been added, and a layerto which a phosphor and ink particles have been added. The impuritiesmay include a phosphor, a diffusing agent, or ink particles. At leastone of the plurality of resin layers may optionally include at least oneof a diffusing agent, a phosphor, and ink particles. That is, each ofthe phosphor, the diffusing agent and the ink particles may be added toa separate resin layer, or may be mixed with each other and disposed atone resin layer. At least one or two or more among the phosphor, thediffusing agent and the ink particles may be added to one resin layer.The layers in which the phosphor and the diffusing agent arerespectively included may be disposed to be adjacent to each other ordisposed to be spaced apart from each other. When the layers at whichthe phosphor and the diffusing agent are arranged are separated fromeach other, the layer at which the phosphor is disposed may be disposedabove the layer at which the diffusing agent is disposed. The phosphorand the ink particles may be disposed at the same layer or at differentlayers from each other. The resin layer to which the ink particles areadded may be disposed more above the resin layer to which the phosphoris added.

FIG. 14 is a side cross-sectional view of a light emitting moduleaccording to a second embodiment.

Referring to FIG. 14, a lighting module 101 may include a substrate 11,a light emitting device 21 disposed on the substrate 11, and a firstresin layer 61 covering the light emitting device 21 on the substrate11. The substrate 11 and the light emitting device 21 will refer to theconfiguration disclosed in FIGS. 1 to 13.

The lighting module 101 may emit the light emitted from the lightemitting device 21 as a surface light source. The lighting module 101may include a reflection member disposed at an upper surface of thesubstrate 11. The reflection member may reflect light traveling to theupper surface of the substrate 11 to the first resin layer 61. The lightemitting device 21 may be disposed on the substrate 11 in plural. Theplurality of light emitting devices 21 disposed on the lighting module101 may be arranged as shown in FIG. 2 or arranged in N columns and Mrows (N and M are integers of 1 or more). A connector may be provided ata part of the upper surface or a lower surface of the substrate 11 tosupply power to the light emitting devices 21.

The light emitting device 21 is an LED chip emitting at least fivesurfaces, and may be disposed on the substrate 11 in a flip chip type.As another example, the light emitting device 21 may be implemented as ahorizontal chip or a vertical chip. The light emitting device 21 is alight emitting diode (LED) chip capable of emitting at least one ofblue, red, green, ultraviolet (UV), and infrared rays. The lightemitting device 21 may emit at least one of blue, red, and green. Thelight emitting device 21 may be sealed with a transparent insulatinglayer or resin at a surface thereof, but is not limited thereto. Thelight emitting device 21 may include a phosphor layer having a phosphorat the surface.

The light emitting device 21 is disposed on the substrate 11 and may besealed by the first resin layer 61. The plurality of light emittingdevices 21 may be in contact with the first resin layer 61. The firstresin layer 61 may be disposed on a side surface and an upper surface ofthe light emitting device 21.

The first resin layer 61 may protect the light emitting devices 21 andmay be in contact with the upper surface of the substrate 11. The lightemitted from the light emitting device 21 may be emitted via the firstresin layer 61. The light emitting device 21 may emit blue light in arange of 400 to 500 nm, for example, 420 to 470 nm.

The first resin layer 61 may be thicker than the light emitting device21. The first resin layer 61 may be a resin material such as atransparent resin material, for example, an ultraviolet (UV) resin,silicone or epoxy.

The first resin layer 61 may include a phosphor. The first resin layer61 may include a phosphor and ink particles. The first resin layer 61may include a phosphor, ink particles, and a diffusing agent. The firstresin layer 61 may include at least one or more of a phosphor, inkparticles, and a diffusing agent. The phosphor may include at least oneof a red phosphor, an amber phosphor, a yellow phosphor, a greenphosphor, and a white phosphor. The diffusing agent may include at leastone of polymethyl methacrylate (PMMA) series, TiO₂, SiO₂, Al₂O₃, andsilicon series. The diffusing agent has a refractive index in a range of1.4 to 2 at the light emission wavelength, and a size thereof may be ina range of 1 to 100 μm. The diffusing agent may be spherical, but is notlimited thereto. As shown in FIG. 29, when the refractive index of thediffusing agent is 1.4 or more, the uniformity of light may be 90% ormore. As shown in FIG. 30, when the size of the diffusing agent is inthe range of 1 to 30 μm, the uniformity of light may be 90% or more. Thelight uniformity may be provided at 90% or more as the light uniformityon a region in which the light emitting devices 21 are connected to eachother.

The ink particles may include at least one of metal ink, UV ink, andcuring ink. A size of the ink particles may be smaller than that of thephosphor. A surface color of the ink particles may be one of green, red,yellow, and blue. A type of the ink may be selectively applied amongpolyvinyl chloride (PVC) ink, polycarbonate (PC) ink, acrylonitrilebutadiene styrene (ABS) copolymer ink, UV resin ink, epoxy ink, siliconeink, polypropylene (PP) ink, polymethyl methacrylate (PMMA) ink, andpolystyrene (PS) ink. Here, a width or diameter of the ink particles maybe in a range of 5 μm or less, or 0.05 to 1 μm. At least one of the inkparticles may be smaller than the wavelength of light.

The color of the ink particles may include at least one of red, green,yellow, and blue. For example, the phosphor emits a red wavelength, andthe ink particles may include red. For example, the red color tone ofthe ink particles may be darker than the color tone of the wavelength ofthe phosphor or light. The ink particles may be a different color fromthe color of the light emitted from the light emitting device 21. Theink particles may give an effect of shielding or blocking incidentlight. The ink particles may include the same color series as thephosphor.

The lighting module 101 according to the second embodiment may include aphosphor and ink particles at the first resin layer 61. Since the lightgenerated from the light emitting device 21 is shielded by the inkparticles, hot spots may be reduced. A concentration of the phosphor maybe remarkably reduced by the ink particles. For example, in the case ofa lighting module without ink particles, a content of the phosphor maybe increased to 35% or more, and in the case of the lighting moduleincluding the ink particles, the content of the phosphor may be reducedto 23% or less. The surface of the lighting module 101 or the surface ofthe first resin layer 61 may be provided similarly to the surface colorby the first resin layer 61 having the ink particles when the light isemitted. That is, the chromaticity or color difference of the surface ofthe first resin layer 61 due to on/off of the light emitting device 21may be reduced.

The first resin layer 61 may include a phosphor, a diffusing agent, andink particles. In this case, a content of the diffusing agent may be ina range of 3 wt % or less, for example, 1 to 3 wt %. The content of thephosphor may be added in a range of 23 wt % or less or 10 to 23 wt %. Acontent of the ink particles may be added in a range of 12 wt % or less,for example, 4 to 12 wt %. In the first resin layer 61, the hot spotsmay be reduced by the content of the diffusing agent and a deteriorationof light transmittance may be prevented. A decrease inwavelength-conversion efficiency may be prevented by the content of thephosphor. The difference of color tone of the surface color may bereduced by the content of the ink particles and the hot spots may belowered.

When the first resin layer 61 includes a phosphor and ink particles, thediffusing agent may be 0 wt %. In such a structure, the content of thephosphor may be added in a range of 23 wt % or less or 10 to 23 wt %,and a content of the ink particles may be added in a range of 12 wt % orless, for example, 4 to 12 wt %. The content of the phosphor in thefirst resin layer 61 may be 3 wt % or more higher than that of the inkparticles, or may be added much higher in the range of 3 to 13 wt %. Theweight of the ink particles is smaller than that of the phosphor so thatthe ink particles may be distributed in a region closer to the surfaceof the first resin layer 61 than the phosphor. Accordingly, the colortone of the surface of the first resin layer 61 may be provided with thecolor tone of the ink particles. The transmission of light may besuppressed by such ink particles, and the hot spots may be lowered.

The color at the surface of the first resin layer 61 may be providedwith the color tone of the ink particles and a difference in color toneof an appearance image due to on/off of the light emitting device 21 maybe reduced, and deterioration of the wavelength-conversion efficiencymay be prevented. In addition, it is possible to reduce the transmissionof the wavelength or the blue light of the light emitted from the lightemitting device 21 via the first resin layer 61. Further, the lightemitted via the first resin layer 61 may be provided as a surface lightsource by the wavelength of the phosphor. A thickness of the first resinlayer 61 may be formed in a range of 3 mm or more, for example, 3 to 5mm. The thickness of the first resin layer 61 may be equal to or lessthan the interval between the light emitting devices 21.

The first resin layer 61 may be molded on the light emitting device 21and cured. The lighting module 101 may have a thickness of 5.5 mm orless, may emit a surface light source via an upper surface and may haveductility characteristics. The lighting module 101 may emit light viathe upper surface and the side surface.

FIG. 15 is a first modified example of the lighting module of FIG. 14.

Referring to FIG. 15, a lighting module 101A may include a substrate 11,a light emitting device 21, a first resin layer 47, and a firstdiffusion layer 62.

In the lighting module 101, a first structural example may include adiffusing agent and a phosphor at the first resin layer 47, and mayinclude ink particles at the first diffusion layer 62. A secondstructural example may include a diffusing agent at the first resinlayer 47 and may include a phosphor and ink particles at the firstdiffusion layer 62. A third structure example has an impurity-free layerat the first resin layer 47, and may include a phosphor, ink particles,and a diffusing agent at the first diffusion layer 62. A fourthstructural example may add a phosphor to the first resin layer 47, andmay include ink particles at the first diffusion layer 62. A fifthstructural example has an impurity-free layer at the first resin layer47 and may have a layer including a phosphor and ink particles at thefirst diffusion layer 62. The fourth structural example and the fifthstructural example may not add a diffusing agent into the first resinlayer 47 and the first diffusion layer 62.

A content of the diffusing agent may be in a range of 3 wt % or less,for example, 1 to 3 wt % in the first resin layer 47. When the contentof the diffusing agent is smaller than the range, there is a limit tolowering hot spots. When the content is larger than the range, the lighttransmittance may be deteriorated. Therefore, the diffusing agent isdisposed in the first resin layer 47 in the above-described content, andthus light may be diffused to reduce hot spots without deteriorating thelight transmittance.

A content of the phosphor added to the first resin layer 47 or the firstdiffusion layer 62 may be added in a range of 23 wt % or less or 10 to23 wt %. Accordingly, the diffusion and wavelength-conversion efficiencyof light in the lighting module may be improved. In addition, it ispossible to reduce the transmission of the wavelength, for example, theblue light, of light emitted from the light emitting device 21 via thefirst diffusion layer 62. Further, the light extracted via the firstdiffusion layer 62 may be provided as a surface light source by thewavelength of the phosphor. The phosphor may include at least one of ared phosphor, an amber phosphor, a yellow phosphor, a green phosphor,and a white phosphor.

A content of the ink particles added to the first diffusion layer 62 maybe added in a range of 12 wt % or less or 4 to 12 wt %. Accordingly, thesurface color at a surface of the first diffusion layer 62 may beimproved and the diffusion of light and hot spots may be prevented. Thecolor of the ink particles may be the same as the color of thewavelength-converted light by the phosphor. The color of the inkparticles may be the same as the color of the phosphor.

The first resin layer 47 may mold the light emitting device 21 and maybe in contact with an upper surface of the substrate 11. A thickness ofthe first resin layer 47 may be provided in a range of 3 mm or more, forexample, 3 to 4 mm. Since the first resin layer 47 is provided in thethickness range, the spread of light may be improved. When at least oneof the diffusing agent and the phosphor is disposed therein, the firstresin layer 47 may improve light diffusibility.

The first diffusion layer 62 may be a resin material such as atransparent resin material, for example, an ultraviolet (UV) resin,epoxy or silicone. A refractive index of the first diffusion layer 62may be 1.8 or less, for example, 1.1 to 1.8, or 1.4 to 1.6, and may belower than a refractive index of the diffusing agent. A thickness of thefirst diffusion layer 62 may be smaller than that of the first resinlayer 47. The thickness of the first diffusion layer 62 may be formed ina range of 0.3 mm or more, for example, 0.3 to 0.7 mm.

The phosphor added in the first diffusion layer 62 may have a differencein content with the resin material of the first diffusion layer 62 by20% or less or 10% or less. The content of the phosphor may be added tothe first diffusion layer 62 in a range of 10 wt % or more or 10 to 23wt %. Accordingly, the color at a surface of the first diffusion layer62 may be provided in the color tone of the phosphor, and the diffusionand wavelength-conversion efficiency of light may be improved. Inaddition, it is possible to reduce the transmission of the wavelength,for example, the blue light, of the light emitted from the lightemitting device 21 via the first diffusion layer 62. Further, the lightextracted via the first diffusion layer 62 may be provided as a surfacelight source by the wavelength of the phosphor. The light may bediffused and wavelength-converted by providing the first diffusion layer62 with the thickness in the range. Such a lighting module may beprovided as a surface light source. The red color tone of the firstdiffusion layer 62 in a state in which the light emitting device 21 isturned off may be darker or higher than that of the light emitted viathe first diffusion layer 62 in a state in which the light emittingdevice 21 is turned on. That is, a surface chroma value of the lightemitting device in the off state may be lower than that of the lightemitting device in the on state. For example, in the off state of thelight emitting device, a surface chroma value of the first diffusionlayer 62 may be close to middle chroma, and when the light emittingdevice is in the on state, the surface chroma value of the firstdiffusion layer 62 or that of emitted light may be close to high chroma.

A thickness of the lighting module 101 may be in a range of 220% orless, for example, 180 to 220% of that of the first resin layer 47 orthe thickness of the lighting module 101 may be a distance from a lowersurface of the substrate 11 to an upper surface of the first diffusionlayer 62. The first diffusion layer 62 may be formed to have a thicknesssmaller than that of the first resin layer 47. The thickness of thefirst diffusion layer 62 may be in a range of 80% or less, for example,40 to 80% of that of the first resin layer 47. Since the first diffusionlayer 62 is provided in a thin thickness, ductility characteristics ofthe lighting module may be secured. Since the lighting module 101 isprovided with a thickness of 5.5 mm or less, the lighting module 101 maybe provided as a flexible and slim surface light source module.

The lighting module according to an embodiment may have a thickness of5.5 mm or less, may emit a surface light source via an upper surface andmay have ductility characteristics. The lighting module may emit lightvia a side surface. The lighting module may include a flexible structureor a curved structure.

FIG. 16 is a modified example of the lighting module of FIG. 15, and thesame part as configuration of FIG. 15 will be described with referenceto the configuration and description of FIG. 15. Referring to FIG. 16,in a lighting module 102, a first diffusion layer 62 may be disposed ona first resin layer 47 covering the light emitting device 21 disclosedin an embodiment, and the first diffusion layer 62 may include a sideportion 62 a covering a side surface of the first resin layer 47. Thefirst diffusion layer 62 may be defined as a second resin layer.

The side portion 62 a of the first diffusion layer 62 is disposed alongthe side surface of the first resin layer 47 and covers the side surfaceof the first resin layer 47. The side portion 62 a may be extended froman edge of an upper surface of the first resin layer 47 in a directionof an upper surface of the substrate 11. The side portion 62 a of thefirst diffusion layer 62 may be in contact with the upper surface of thesubstrate 11. The side portion 62 a of the first diffusion layer 62 iscontacted along the outer circumference of the substrate 11, so thatmoisture penetration may be prevented and a side surface of the lightingmodule may be protected. The side portion 62 a of the first diffusionlayer 62 may include the above-described phosphor and ink particles. Theside portion 62 a of the first diffusion layer 62 may be formed at oneside surface, at least two side surfaces or all side surfaces of thefirst resin layer 47 or may open at least one side surface. Some lightmay be extracted via the opened region.

Since ink particles are added to the first diffusion layer 62 and theside portion 62 a, a difference between the color tone of the surfacecolor of the first diffusion layer 62 when the light emitting device 21is driven and the color tone of that when the light emitting device 21is not driven may be reduced. That is, the color tone due to the inkparticles may be seen in a clearer and deeper color even when the lightemitting device 21 is turned off when viewed from a relatively fardistance. Accordingly, even when the light emitting device 21 is in anon/off state, the difference in the color tone of the surface of thelighting module may be reduced. A content of the ink particles added tothe side portion 62 a of the first diffusion layer 62 may be equal to orhigher than an upper surface portion of the first diffusion layer 62.

An adhesive may be disposed between the first resin layer 47 and thefirst diffusion layer 62. The adhesive may be, as a transparentmaterial, an adhesive such as UV adhesive, silicone or epoxy. The firstdiffusion layer 62 may be adhered in a film form or may beinjection-molded. When the first diffusion layer 62 is provided in theform of a film, the first diffusion layer 62 may be adhered with anadhesive, may provide a uniform light distribution, and may provide thecolor tone of a surface color at a predetermined level or more. Thefirst diffusion layer 62 may be a second resin layer to be describedlater. As another example, without the adhesive, the first diffusionlayer 62 may be attached with the surface adhesion of the first resinlayer 47. The phosphor in the first diffusion layer 62 may be disposedon the upper surface of the first resin layer 47 or may be spaced apartfrom the light emitting device 21. The phosphor and ink particles in thefirst diffusion layer 62 may be disposed on the upper surface of thefirst resin layer 47. The phosphor and the ink particles may be disposedto be spaced from the light emitting device 21 or disposed on the uppersurface of the first resin layer 47. As the phosphor moves away from thelight emitting device 21, wavelength-conversion efficiency may beimproved. As the ink particles move away from the light emitting device21 or closer to the surface of the first diffusion layer 62, visibilityof the surface color may be improved.

In the second embodiment of the invention, a comparison of luminous fluxaccording to the content of phosphor and ink particles added to thefirst diffusion layer 62 without adding a diffusing agent to the firstresin layer 47 is as follows. For experiment, as shown in Table 1, a redphosphor and red ink particles are added to the first diffusion layer inan example, and a reference example Ref is an example in which thecontent of the red phosphor without red ink particles is 50 wt % and thecontent of the diffusing agent is 10 wt %.

In Example 1, Example 2, and Example 3 in the first diffusion layer 62,the content of the phosphor is 10 wt % and the content of the red inkparticles is 5 wt %, 7 wt %, and 10 wt %, respectively. In Examples 4, 5and 6, the content of the phosphor is 15 wt % and the content of the redink particles is 5 wt %, 7 wt %, and 10 wt %, respectively. In Examples7, 8 and 9, the content of the phosphor is 20 wt % and the content ofthe red ink particles is 5 wt %, 7 wt %, and 10 wt %, respectively.

TABLE 1 Phosphor [wt %] Red Ink [wt %] Example 1 10 5 Example 2 7Example 3 10 Example 4 15 5 Example 5 7 Example 6 10 Example 7 20 5Example 8 7 Example 9 10

In the structure of FIGS. 15 and 16, Table 1 shows a configuration inwhich Examples 1 to 9 are tested such that the phosphor and the inkparticles are added to the first diffusion layer in the above-describedcontents.

FIG. 35 is a view illustrating a comparison of a color tone of areference example with a color tone of a surface color of Examples 1 to9 in a state in which the light emitting device 21 is turned off in thelighting module of FIGS. 15 and 16. FIG. 36 is a view illustrating acomparison of a color tone of a reference example with a color tone of asurface color of Examples 1 to 9 in a state in which the light emittingdevice 21 is turned on in the lighting module of FIGS. 15 and 16. Here,the surface in the lighting module represents the surface of the firstdiffusion layer.

As shown in FIGS. 35 and 36, when the light emitting device 21 is in theoff state, the surface color of the reference example Ref becomes amber,but in Examples 1 to 9, the surface color becomes red. When the lightemitting device 21 is in the on state, it can be seen that the colortone of the surface color may be brighter as the content of the phosphorincreases, and the luminous flux is deteriorated as the content of theink particles increases.

Table 2 is a table illustrating a comparison of the color coordinatesand the luminous fluxes of the reference example and Examples 1 to 9 ofTable 1, respectively.

TABLE 2 Experimental Example CIE (Cx, Cy) Luminous flux (lm) Ref Cx:0.6903 74.88 Cy: 0.3011 Example 1 Cx: 0.6882 59.86 Cy: 0.3053 Example 2Cx: 0.6912 43.60 Cy: 0.3006 Example 3 Cx: 0.6942 30.70 Cy: 0.2968Example 4 Cx: 0.6902 63.75 Cy: 0.3031 Example 5 Cx: 0.6885 52.27 Cy:0.3028 Example 6 Cx: 0.6938 34.08 Cy: 0.2971 Example 7 Cx: 0.6921 60.45Cy: 0.3011 Example 8 Cx: 0.6872 53.63 Cy: 0.3037 Example 9 Cx: 0.691734.46 Cy: 0.2994

In Table 2, the luminous flux is the highest in the reference example.However, as shown in FIGS. 35 and 36, the difference in the color toneof the appearance image depending on the on/off state of the lightemitting device in the lighting module is large. In this case, thevisibility of the module may be deteriorated when the light emittingdevice is turned off. In addition, the case may also cause an increasein the content of the phosphor.

It can be seen that in Examples 1 to 9, the difference in colorcoordinates from the reference example is not large, and the color toneof the appearance image shows in red in the on/off state of the lightemitting device. Example 1, Example 4 and Example 7 in which thedifference in the luminous flux is 20% or less and the color tone of thesurface is red, as compared with the reference example may be selectedamong Examples 1 to 9. Here, in Examples 1, 4 and 7, when the content ofthe red ink particles with respect to the first diffusion layer is inthe range of 5 wt %, and the content of the phosphor is in the range of10 wt % to 20 wt %, it can be seen that luminous flux is the highest.

As shown in FIG. 37, the Examples 1 to 9 show the comparison of luminousfluxes in the samples (spl #1, 2, 3) of the lighting module providedwith the first diffusion layer by adding the above-described contents ofthe phosphor and the ink particles, and as shown in FIG. 38, Examples 1to 9 of the samples may be distributed on the color coordinate regionsG1, G2 and G3. That is, optimum Examples 1 to 9 may be selected and usedbased on the color coordinate regions of the samples 1, 2, and 3 of thelighting module. Therefore, the second embodiment of the invention mayselectively add the content of the ink particles in the first diffusionlayer in the range of 4 to 12 wt % and the content of the phosphor inthe range of 10 wt % to 23 wt %, based on the above-describedexperimental examples.

FIG. 17 is a third modified example of the lighting module according tothe second embodiment.

Referring to FIG. 17, the lighting module may include a substrate 11, alight emitting device 21, a first resin layer 47, a second diffusionlayer 51, and a second resin layer 63. The first resin layer may includea diffusing agent or may be provided without a diffusing agent. Thefirst resin layer may be function as a first diffusion layer. The seconddiffusion layer 51 may be a layer to which a phosphor is added. Thesecond resin layer 63 may be a layer to which ink particles are added.As another example, the second diffusion layer may be a layer to which aphosphor and a diffusing agent are added. As another example, the secondresin layer 63 may include a phosphor and ink particles. Here, aphosphor may be added to the second diffusion layer and the second resinlayer 63, and the second diffusion layer 51 and the second resin layer63 may include the same phosphor or different phosphors.

The second resin layer 63 may be disposed on the second diffusion layer51. The second diffusion layer 51 may be disposed between the firstresin layer and the second resin layer 63. A thickness of the secondresin layer 63 may be smaller than that of the second diffusion layer51. The thickness of the second diffusion layer 51 may be formed in arange of 0.3 mm or more, for example, 0.3 to 0.7 mm. The thickness ofthe second resin layer 63 may be formed in a range of 0.1 mm or more,for example, 0.1 to 0.5 mm.

At least one or both of the second diffusion layer and the second resinlayer 63 may cover a side surface of the first resin layer.

The phosphor may include at least one of red, green, blue, amber, andyellow phosphors. The ink particles may have the same color as the colorof the phosphor or the wavelength-converted color from the phosphor.

FIG. 18 is a modified example of FIG. 17, and is a fourth modifiedexample of the lighting module according to the second embodiment.

Referring to FIG. 18, the lighting module may include a substrate 11, alight emitting device 21, a first resin layer 31, a first diffusionlayer 41, and a second resin layer 64. The second resin layer 64 may bedisposed at a side surface of the first resin layer 31. A side portion64 a of the second resin layer 64 may be adhered to an upper surface ofthe substrate 11. The side portion 64 a of the second resin layer 64 maybe in contact with a side surface of the first diffusion layer 41 andthe side surface of the first resin layer 31. Accordingly, the secondresin layer 64 may improve the difference of color tone of the surfacecolor in a side direction. A phosphor may be disposed at the firstdiffusion layer 41, or a phosphor and a diffusing agent may be addedthereto. The second resin layer 64 may include a phosphor and inkparticles.

FIG. 19 is a modified example of FIG. 17, and is a fifth modifiedexample of the lighting module according to the second embodiment.

Referring to FIG. 19, the lighting module may include a substrate 11, alight emitting device 21, a first resin layer 31, a second diffusionlayer 56, and a second resin layer 66. The second resin layer 66 may bedisposed at a side surface of the first resin layer 31. The second resinlayer 66 may be function as a first diffusion layer. A side portion 66 aof the second resin layer 66 may be adhered to an upper surface of thesubstrate 11. The side portion 66 a of the second resin layer 66 may bein contact with a side surface of the second diffusion layer 56 and theside surface of the first resin layer 31. A phosphor may be added to thesecond diffusion layer 56, or a phosphor and a diffusing agent may beadded thereto. The second resin layer 66 may include ink particleswithout a phosphor. Accordingly, the second resin layer 66 may improvethe difference of color tone of the surface color in a side direction.

FIG. 20 is a modified example of FIG. 17, and is a sixth modifiedexample of the lighting module according to the second embodiment.

Referring to FIG. 20, the lighting module may include a substrate 11, alight emitting device 21, a first resin layer 47, a first diffusionlayer 52, and a second resin layer 63. The first diffusion layer 52 maybe disposed at a side surface of the first resin layer 47. A sideportion 52 a of the first diffusion layer 52 may be adhered to an uppersurface of the substrate 11. The side portion 52 a of the firstdiffusion layer 52 may be in contact with the side surface of the firstresin layer 47. The first resin layer 47 may be provided with atransparent material with a diffusing agent added thereto or without adiffusing agent. A phosphor may be added to the first diffusion layer52. The second resin layer 63 may include ink particles without aphosphor. The side portion 52 a of the first diffusion layer 52 coversthe side surface of the first resin layer 47. The side portion 52 a ofthe first diffusion layer 52 may be exposed in a side direction of thelighting module. The surface color of the side portion 52 a of the firstdiffusion layer 52 and the surface color of the second resin layer 63may be different from each other. The surface color of the second resinlayer 63 may have a darker color tone than that of the side portion 52 aof the first diffusion layer 52.

Referring to FIGS. 17 and 20, the content of the ink particles added tothe above-described resin layers 63, 64, and 66 may be added in therange of 12 wt % or less or 4 to 12 wt %. Accordingly, it is possible toimprove the surface color at the surface of the resin layers 63, 64, and66 and to prevent hot spots via light shielding. The color of the inkparticles may be the same as the color of the wavelength-converted lightby the phosphor. The color of the ink particles may be the same as thecolor of the phosphor.

The thickness of the diffusion layers 51, 41, and 52 may be formed in arange of 0.3 mm or more, for example, 0.3 to 0.7 mm. The content of thephosphor added to the diffusion layers 51, 41, and 52 may be added in arange of 10 wt % or more or 10 to 23 wt %.

FIGS. 21 to 24 are seventh to tenth modified examples of the secondembodiment, and are a structure in which two or more layers arelaminated on the first resin layer.

Referring to FIG. 21, the lighting module may include a substrate 11, alight emitting device 21, a first resin layer 31, a first diffusionlayer 41, a second diffusion layer 56, and a second resin layer 63. Theconfiguration of the second resin layer 63 is the same as that of theabove-described configuration, and the configuration of the first andsecond diffusion layers 41 and 56 will be described with reference tothe description of the first embodiment.

For example, a diffusing agent may be added to the first diffusion layer41, and a phosphor may be added to the second diffusion layer 56. Theabove-described ink particles may be added to the second resin layer 63.A side portion 63 a of the second resin layer 63 covers side surfaces ofthe first and second diffusion layers 41 and 56 and a side surface ofthe first resin layer 31. The side portion 63 a of the second resinlayer 63 may be in contact with the side surfaces of the first andsecond diffusion layers 41 and 56 and the side surface of the firstresin layer 31 and in contact with an upper surface of the substrate 11.

Referring to FIG. 22, the lighting module may include a substrate 11, alight emitting device 21, a first resin layer 47, a first diffusionlayer 52, and a second resin layer 63. The configuration of the secondresin layer 63 is the same as the above-described configuration, and theconfiguration of the first diffusion layer 52 will be described withreference to the description of the first and second embodiments.

For example, a phosphor may be added to the first diffusion layer 52, ora phosphor and a diffusing agent may be added. When the first diffusionlayer 52 has a diffusing agent, a phosphor and ink particles may beadded to the second resin layer 63. When a phosphor is added to thefirst diffusion layer 52, the second resin layer 63 may include inkparticles without a phosphor.

A side portion 52 a of the first diffusion layer 52 may be disposed on aside surface of the second resin layer 63. A side portion 63 a of thesecond resin layer 63 may be disposed at an outside of the side portion52 a of the first diffusion layer 52. The side portion 63 a of thesecond resin layer 63 may be disposed between the side portion 52 a ofthe first diffusion layer 52 and a side surface of the first resin layer47. The side portion 52 a of the first diffusion layer 52 and the sideportion 63 a of the second resin layer 63 may be in contact with anupper surface of the substrate 11.

Referring to FIG. 23, the lighting module may include a substrate 11, alight emitting device 21, a first resin layer 31, a first diffusionlayer 41, a second diffusion layer 57, and a second resin layer 63. Theconfiguration of the second resin layer 63 is the same as that of theabove-described configuration, and the configuration of the first andsecond diffusion layers 41 and 57 will be described with reference tothe description of the first embodiment.

For example, a diffusing agent may be added to the first diffusion layer41, and a phosphor may be added to the second diffusion layer 57. Theabove-described ink particles may be added to the second resin layer 63.

A side portion 57 a of the second diffusion layer 57 may be disposed ona side surface of the first resin layer 47. A side portion 63 a of thesecond resin layer 63 may be disposed at an outside of the side portion57 a of the second diffusion layer 57. The side portion 63 a of thesecond resin layer 63 may be disposed between the side portion 57 a ofthe second diffusion layer 57 and a side surface of the first resinlayer 31. The side portion 57 a of the second diffusion layer 57 and theside portion 63 a of the second resin layer 63 may be in contact with anupper surface of the substrate 11.

Referring to FIG. 24, the lighting module may include a substrate 11, alight emitting device 21, a first resin layer 31, a first diffusionlayer 41, a second diffusion layer 56, and a second resin layer 63. Theconfiguration of the second resin layer 63 is the same as that of theabove-described configuration, and the configuration of the first andsecond diffusion layers 41 and 56 will be described with reference tothe description of the first embodiment.

For example, a diffusing agent may be added to the first diffusion layer41, and a phosphor may be added to the second diffusion layer 56. Theabove-described ink particles may be added to the second resin layer 63.

A side portion 41 a of the first diffusion layer 41 may be disposed on aside surface of the first resin layer 31. A side portion 56 a of thesecond diffusion layer 56 may be disposed at an outside of the sideportion 41 a of the first diffusion layer 41. A side portion 63 a of thesecond resin layer 63 may be disposed at an outside of the side portion56 a of the second diffusion layer 56. The side portion 56 a of thesecond diffusion layer 56 may be disposed between the side portion 41 aof the first diffusion layer 41 and the side portion 63 a of the secondresin layer 63. The side portion 41 a of the first diffusion layer 41,the side portion 56 a of the second diffusion layer 56 and the sideportion 63 a of the second resin layer 63 may be in contact with anupper surface of the substrate 11.

FIG. 25 is an eleventh modified example of the lighting module accordingto the second embodiment.

Referring to FIG. 25, the lighting module may include a substrate 11, alight emitting device 21 disposed on the substrate 11, a first resinlayer 31 on the substrate 11, an adhesive layer 45 and a light shieldingportion 46 on the first resin layer 31, a first diffusion layer 52 onthe adhesive layer 45 and the light shielding portion 46, and a secondresin layer 63 on the first diffusion layer 52. The configuration of thefirst diffusion layer 52 and the second resin layer 63 will be describedwith reference to the description of the second embodiment disclosedabove.

The adhesive layer 45 may be adhered between the first resin layer 31and the first diffusion layer 52. The adhesive layer 45 may be the samematerial as that of the first resin layer 31 and the first diffusionlayer 52 or may be formed of a different material. The adhesive layer 45may be a resin material such as silicone or epoxy. The adhesive layer 45may be disposed at a circumference of the light shielding portion 46 ormay be extended to a lower surface of the light shielding portion 46.The light shielding portion 46 may be disposed at a lower surface of thefirst diffusion layer 41 at a region corresponding to the light emittingdevice 21. The light shielding portion 46 may be in a range of 50% ormore, for example, 50% to 120% of the upper surface area of the lightemitting device 21 on the light emitting device 21. The light shieldingportion 46 may be formed through a region in which a white material isprinted. The light shielding portion 46 may be printed by using, forexample, a reflection ink including any one of Al₂O₃ CaCO, BaSO₄, andsilicon. The light shielding portion 46 may reflect light emitted viathe light exit surface of the light emitting device 21 to reduce theoccurrence of hot spots due to the luminous intensity of light on thelight emitting device 21. The light shielding portion 46 may print alight shielding pattern by using light shielding ink. The lightshielding portion 46 may be formed to be printed at a lower surface ofthe first diffusion layer 52. The light shielding portion 46 may notshield 100% of incident light, but transmittance may be lower thanreflectance, so that the light shielding portion 46 may perform afunction of shielding and diffusing the light. The light shieldingportion 46 may be formed as a single layer or multiple layers, and mayhave the same pattern shape or different pattern shapes.

The second resin layer 63 may include the above-described side portion63 a to cover side surfaces of the first resin layer 31 and the firstdiffusion layer 52. As another example, the side portion 63 a may beformed by being extended by the first diffusion layer 52. As anotherexample, although an example in which the side portion 63 a of thesecond resin layer 63 is in contact with an upper surface of thesubstrate 11 has been described, the side portion 63 a may be in contactwith an upper surface of any one of the first resin layer 31 and thefirst diffusion layer 52. As another example, the side portion 63 a ofthe second resin layer 63 may be in contact with at least one of theupper surfaces of the first resin layer 31 and the first diffusion layer52 and the upper surface of the substrate 11. In this case, the outercircumferences of the first resin layer 31 and the first diffusion layer52 may be provided in a concave-convex pattern or a stepped structure.

Referring to FIG. 26, the lighting module of FIGS. 15 and 16 accordingto an embodiment of the invention may be turned on or off. In the lightemitting device 21, for example, it is possible to reduce the differencein color tone between the surface color (Color 1) of the first diffusionlayer or the second resin layer, which is the uppermost layer in the offstate of an LED and the surface color (Color 2) of the first diffusionlayer or the second resin layer, which is the uppermost layer in the LEDon state.

In the lighting module of an embodiment, the first resin layer may bedisposed on the substrate 11 and/or the second resin layer may bedisposed on the first diffusion layer. The embodiment may provide aflexible lighting module having a plurality of resin layers on thesubstrate 11. The lighting module of an embodiment allow light to beguided in a radial or linear direction in the first resin layer 31 todiffuse and to be wavelength-converted by the phosphor of the firstdiffusion layer 41, and the difference in color tone of the surfacecolor may be improved via the ink particles of the second resin layer.Accordingly, the light to be finally emitted via the lighting module isemitted as the surface light source. In addition, the plurality of lightemitting devices 21 in the lighting module 100 may emit light at fivesurfaces thereof on the flexible substrate in a flip manner, and thelight emitted via the upper surface and the side surface of the lightemitting device 21 may be emitted in upper surface and side directions.Electrodes at a lower portion of the light emitting device 21 may facethe substrate 11.

The light emitted from the light emitting device 21 may emit light indirections of an upper surface and all side surfaces of the lightingmodule. The above-described lighting module may be applied to a lamp ofa vehicle, a display device having a micro LED, or various lightingapparatuses.

The above-described lighting module provides a surface light source, sothat an additional inner lens may be removed, and an air gap on thelight emitting device 21 or a structure for inserting the light emittingdevice 21 may be removed by sealing the light emitting devices 21 withthe first resin layer 31.

The lighting module 100 may be provided in a flat plate shape, a convexcurved shape, a concave curved shape, or a convex-concave shape whenviewed from the side. The lighting module may be a bar shape like astripe, a polygonal shape, a circular shape, an elliptical shape, ashape having a convex side surface, or a shape having a concave sidesurface when viewed from the top view.

FIG. 32 is a view illustrating an example of a light emitting device ofa lighting module according to an embodiment.

Referring to FIG. 32, the light emitting device includes a lightemitting structure 225 and a plurality of electrodes 245 and 247. Thelight emitting structure 225 may be formed with a compound semiconductorlayer of elements of Groups II to VI, e.g. a compound semiconductorlayer of Group III-V elements or a compound semiconductor layer of GroupII-VI elements. The plurality of electrodes 245 and 247 are selectivelyconnected to the semiconductor layer of the light emitting structure 225to supply power.

The light emitting device may include a light transmitting substrate221. The light transmitting substrate 221 is disposed on the lightemitting structure 225. The light transmitting substrate 221 may be, forexample, a light transmittable, insulating substrate, or a conductivesubstrate. For example, the light transmitting substrate 221 may use atleast one of sapphire (Al₂O₃), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP,Ge, and Ga₂O₃. A plurality of convex portions (not shown) may be formedon at least one or all of a top surface and a bottom surface of thelight transmitting substrate 221 to improve light extraction efficiency.A side cross-sectional view of each convex portion may include at leastone of a hemispherical shape, a half-oval shape, or a polygonal shape.The light transmitting substrate 221 may be removed, but is not limitedthereto.

At least one of a buffer layer (not shown) and a lower conductivesemiconductor layer (not shown) may be included between the lighttransmitting substrate 221 and the light emitting structure 225. Thebuffer layer is a layer for mitigating a difference in lattice constantbetween the light transmitting substrate 221 and the semiconductorlayer, and may be selectively formed of compound semiconductors ofGroups II to VI. An undoped compound semiconductor layer of Group III-Vmay be further formed under the buffer layer, but is not limitedthereto.

The light emitting structure 225 may be disposed under the lighttransmitting substrate 221 and include a first conductivity typesemiconductor layer 222, an active layer 223, and a second conductivitytype semiconductor layer 224. Other semiconductor layers may be furtherdisposed at least one of on and under each of the layers 222, 223, and224, but is not limited thereto.

The first conductivity type semiconductor layer 222 may be disposedunder the light transmitting substrate 221, and be implemented as asemiconductor to which a first conductivity type dopant is doped, forexample, an n-type semiconductor layer. The first conductivity typesemiconductor layer 222 includes the empirical formula ofIn_(x)Al_(y)Ga_(1-x-y)N (0≥x≥1, 0≥y≥1, 0≥x+y≥1). A material of the firstconductivity type semiconductor layer 222 may be selected from compoundsemiconductors of Group III-V elements such as GaN, AlN, AlGaN, InGaN,InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. The firstconductivity type dopant is an n-type dopant, which includes dopantssuch as Si, Ge, Sn, Se, and Te. The active layer 223 is disposed underthe first conductivity type semiconductor layer 222, selectivelyincludes a single quantum well, a multiple quantum well (MQW), a quantumwire structure, or a quantum dot structure, and includes periods of awell layer and a barrier layer. The periods of the well layer/barrierlayer include, for example, at least one among pairs of InGaN/GaN,GaN/AlGaN, AlGaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, AlGaAs/GaA,InGaAs/GaAs, InGaP/GaP, AlInGaP/InGaP, and InP/GaAs. The secondconductivity type semiconductor layer 224 is disposed under the activelayer 223. The second conductivity type semiconductor layer 224 includesa semiconductor to which a second conductivity type dopant is doped, forexample, the empirical formula of In_(x)Al_(y)Ga_(1-x-y)N (0≥x≥1, 0≥y≥1,0≥x+y≥1). The second conductivity type semiconductor layer 224 may beformed of at least one compound semiconductor of GaN, InN, AlN, InGaN,AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. The secondconductivity type semiconductor layer 224 is a p-type semiconductorlayer, and the first conductivity type dopant is a p-type dopant, whichmay include Mg, Zn, Ca, Sr, and Ba.

As another example, in the light emitting structure 225, the firstconductivity type semiconductor layer 222 may be implemented as a p-typesemiconductor layer, and the second conductivity type semiconductorlayer 224 may be implemented as an n-type semiconductor layer. A thirdconductivity type semiconductor layer having opposite polarity from thesecond conductivity type semiconductor layer 224 may be formed under thesecond conductivity type semiconductor layer 224. Also, the lightemitting structure 225 may be implemented as any one structure among ann-p junction structure, a p-n junction structure, an n-p-n junctionstructure, and a p-n-p junction structure.

First and second electrodes 245 and 247 are disposed under the lightemitting structure 225. The first electrode 245 is electricallyconnected to the first conductivity type semiconductor layer 222, andthe second electrode 247 is electrically connected to the secondconductivity type semiconductor layer 224. The first and secondelectrodes 245 and 247 may have a polygonal or circular bottom shape.The light emitting structure 225 may include a plurality of recesses 226therein.

The light emitting device includes first and second electrode layers 241and 242, a third electrode layer 243, and insulating layers 231 and 233.Each of the first and second electrode layers 241 and 242 may be formedas a single layer or multiple layers, and may function as a currentspreading layer. The first and second electrode layers 241 and 242 mayinclude a first electrode layer 241 disposed under the light emittingstructure 225 and a second electrode layer 242 disposed under the firstelectrode layer 241. The first electrode layer 241 diffuses a currentsuch that the second electrode layer 242 reflects incident light.

The first and second electrode layers 241 and 242 may be formed withdifferent materials. The first electrode layer 241 may be formed of alight transmittable material, for example, a metal oxide or a metalnitride. The first electrode layer 241 may be selectively formed fromindium tin oxide (ITO), ITO nitride (ITON), indium zinc oxide (IZO), IZOnitride (IZON), indium zinc tin oxide (IZTO), indium aluminum zinc oxide(IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide(IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), and galliumzinc oxide (GZO). The second electrode layer 242 may come in contactwith a lower surface of the first electrode layer 241 and function as areflection electrode layer. The second electrode layer 242 includes ametal, for example, Ag, Au, or Al. When a partial region of the firstelectrode layer 241 is removed, the second electrode layer 242 maypartially come in contact with a lower surface of the light emittingstructure 225.

As another example, the first and second electrode layers 241 and 242may be stacked with an omni-directional reflector (ODR) structure. TheODR structure may be formed with a stacked structure of the firstelectrode layer 241 having a low refractive index and the secondelectrode layer 242, which is a highly reflective metal material comingin contact with the first electrode layer 241. The electrode layers 241and 242 may be formed with a stacked structure of ITO/Ag. Anomni-directional reflection angle may be improved at an interfacebetween the first electrode layer 241 and the second electrode layer242.

As another example, the second electrode layer 242 may be removed, andmay be formed as a reflection layer of another material. The reflectionlayer may be formed using a distributed Bragg reflector (DBR) structure.The DBR structure includes a structure in which two dielectric layershaving different refractive indexes are alternately disposed, and mayinclude, for example, any different one among a SiO₂ layer, a Si₃N₄layer, a TiO₂ layer, an Al₂O₃ layer, and an MgO layer. As still anotherexample, the electrode layers 241 and 242 may include both the DBRstructure and the ODR structure, and in this case, a light emittingdevice having a light reflection rate of 98% or greater may be provided.Since light reflected from the second electrode layer 242 is emitted viathe light transmitting substrate 221 in the light emitting devicemounted in the flip method, most light may be emitted vertically upward.The light emitted to the side surface of the light emitting device maybe reflected by the reflection member to a light exit region via anadhesive member according to an embodiment.

The third electrode layer 243 is disposed under the second electrodelayer 242, and is electrically insulated from the first and secondelectrode layers 241 and 242. The third electrode layer 243 includes atleast one metal of titanium (Ti), copper (Cu), nickel (Ni), gold (Au),chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), andphosphorus (P). The first electrode 245 and the second electrode 247 aredisposed under the third electrode layer 243.

The insulating layers 231 and 233 block unnecessary contact between thefirst and second electrode layers 241 and 242, the third electrode layer243, the first and second electrodes 245 and 247, and the light emittingstructure 225. The insulating layers 231 and 233 include first andsecond insulating layers 231 and 233 and the first insulating layer 231is disposed between the third electrode layer 243 and the secondelectrode layer 242. The second insulating layer 233 is disposed betweenthe third electrode layer 243 and the first and second electrodes 245and 247.

The third electrode layer 243 is connected to the first conductivitytype semiconductor layer 222. A connection portion 244 of the thirdelectrode layer 243 may protrude in a via structure via the first andsecond electrode layers 241 and 242 and the lower portion of the lightemitting structure 225, and may come in contact with the firstconductivity type semiconductor layer 222. The connection portion 244may be disposed in plural. A part 232 of the first insulating layer 231extends along the recess 226 of the light emitting structure 225 at acircumference of the connection portion 244 of the third electrode layer243 to block electrical connections between the third electrode layer243 and the first and second electrode layers 241 and 242, and thesecond conductivity type semiconductor layer 224 and the active layer223. An insulating layer may be disposed at a side surface of the lightemitting structure 225 for side surface protection, but is not limitedthereto.

The second electrode 247 is disposed under the second insulating layer233, and comes in contact with or is connected to at least one of thefirst and second electrode layers 241 and 242 via an open region of thesecond insulating layer 233. The first electrode 245 is disposed underthe second insulating layer 233 and connected to the third electrodelayer 243 via the open region of the second insulating layer 233.Accordingly, a protrusion 248 of the second electrode 247 iselectrically connected to the second conductivity type semiconductorlayer 224 via the first and second electrode layers 241 and 242, and aprotrusion 246 of the first electrode 245 is electrically connected tothe first conductivity type semiconductor layer 222 via the thirdelectrode layer 243. The electrodes 245 and 247 below the light emittingdevice may face the substrate.

FIG. 39 is a plan view of a vehicle to which a lamp of a vehicle towhich the lighting module according to the embodiment is applied isapplied, and FIG. 40 is a view illustrating a vehicle lamp having thelighting module or the lighting apparatus disclosed in an embodiment.

Referring to FIGS. 39 and 40, a taillight 800 in a vehicle 900 mayinclude a first lamp unit 812, a second lamp unit 814, a third lamp unit816, and a housing 810. Here, the first lamp unit 812 may be a lightsource serving as a turn signal lamp, the second lamp unit 814 may be alight source serving as a side marker lamp, and the third lamp unit 816may be a light source serving as a stop lamp, but is not limitedthereto. At least one or all of the first to third lamp units 812, 814,and 816 may include the lighting module disclosed in an embodiment. Thehousing 810 accommodates the first to third lamp units 812, 814, and816, and may be made of a light transmitting material. At this point,the housing 810 may have a curve according to a design of a vehiclebody, and the first to third lamp units 812, 814, and 816 may have acurved surface light source according to a shape of the housing 810.Such a vehicle lamp may be applied to a turn signal lamp of a vehiclewhen the lamp unit is applied to a tail lamp, a stop lamp, or a turnsignal lamp of a vehicle.

According to an embodiment of the invention, it is possible to improvethe light uniformity of a surface light source in a lighting module.

According to an embodiment of the invention, it is possible to improvethe uniformity of a surface light source by guiding, diffusing, andemitting light in a lighting module.

According to an embodiment of the invention, it is possible to improvethe uniformity of wavelength-converted light by allowing light diffusedin a lighting module to be wavelength-converted to a phosphor.

According to an embodiment of the invention, it is possible to reducehot spots on each light emitting device in a lighting module.

According to the embodiment of the invention, there is an effect that itis possible to realize an image with a color of a phosphor film at thetime of lighting by providing a colored phosphor film on a lightingmodule.

According to an embodiment of the invention, a flexible lighting modulecan be realized by stacking a plurality of diffusion layers of a resinmaterial,

Embodiments of the invention can improve the light efficiency andbacklighting characteristics of a lighting module.

Embodiments of the invention can reduce the difference in chromaticitybetween an appearance image and a light emission image of a resin layerof a lighting module.

Embodiments of the invention can reduce an amount of a phosphor byarranging ink particles having the same color as a light emission colorof a phosphor in the upper most layer of a lighting module.

Embodiments of the invention can improve an unlighted color of alighting module.

Embodiments of the invention can improve the optical reliability of alighting module and a lighting apparatus having the same.

Embodiments of the invention can improve the reliability of a vehiclelighting apparatus having a lighting module.

Embodiments of the invention can be applied to a backlight unit, variousdisplay devices, a surface light source illumination device, or avehicle lamp having a lighting module.

The characteristics, structures and effects described in theabove-described embodiments are included in at least one embodiment butare not limited to one embodiment. Furthermore, the characteristic,structure, and effect illustrated in each embodiment may be combined ormodified for other embodiments by a person skilled in the art. Thus, itwould be construed that contents related to such a combination and sucha modified example are included in the scope of the invention.

In addition, embodiments are mostly described above. However, they areonly examples and do not limit the invention. A person skilled in theart may appreciate that several variations and applications notpresented above may be made without departing from the essentialcharacteristics of the embodiments. For example, each componentparticularly represented in the embodiments may be varied. In addition,it should be construed that differences related to such a variation andsuch an application are included in the scope of the invention definedin the following claims.

What is claimed is:
 1. A lighting module comprising: a substrate; a plurality of light emitting devices disposed on the substrate and emitting blue light; a first resin layer disposed on the substrate and sealing the plurality of light emitting devices; and a first diffusion layer disposed on the first resin layer and including a phosphor; wherein the first resin layer is disposed on upper surfaces and side surfaces of the plurality of light emitting devices, and wherein a content of the phosphor included in the first diffusion layer is in a range of 10 wt % to 23 wt % in resin material of the first diffusion layer.
 2. The lighting module of claim 1, wherein an interval between the plurality of light emitting devices is greater than or equal to a thickness of the first resin layer, wherein the thickness of the first resin layer is greater than a thickness of the substrate, and wherein the thickness of the first resin layer is a height from a lower surface of the first resin layer to an upper surface of the first resin layer.
 3. The lighting module of claim 2, wherein the thickness of the first resin layer is greater than a thickness of the first diffusion layer, and wherein the thickness of the first diffusion layer is a height from a lower surface of the first diffusion layer to an upper surface of the first diffusion layer disposed on the upper surface of the first resin layer.
 4. The lighting module of claim 3, wherein light emitted to an outside through the first diffusion layer has a light uniformity of 90% or more.
 5. The lighting module of claim 3, wherein the first diffusion layer emits a red light.
 6. The lighting module of claim 5, wherein the first resin layer and the first diffusion layer are formed of a same resin material, and wherein the first resin layer is formed in a layer without a diffusing agent.
 7. The lighting module of claim 6, wherein the first diffusion layer includes an upper portion covering the upper surface of the first resin layer and a side portion extending from the upper portion toward the substrate and covering side surfaces of the first resin layer.
 8. The lighting module of claim 3, wherein the thickness of the first resin layer is in a range of 2.7 mm or less, wherein each of the plurality of light emitting devices emits a wavelength in a range of 420 nm to 470 nm, wherein a straight distance between a lower surface of the substrate and the upper surface of the first diffusion layer is 220% or less of the thickness of the first resin layer, and wherein the thickness of the first diffusion layer is in a range of 40% to 80% of the thickness of the first resin layer.
 9. The lighting module of claim 3, wherein each of the plurality of light emitting devices includes: a light transmitting substrate; a light emitting structure having a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer and disposed under the light transmitting substrate; a first electrode connected to the first conductivity type semiconductor layer and disposed under the light emitting structure; and a second electrode connected to the second conductivity semiconductor layer and disposed under the light emitting structure, wherein the first electrode and the second electrode of the light emitting device are connected to the substrate in a flip chip type.
 10. The lighting module of claim 3, wherein the first diffusion layer includes a diffusing agent, and wherein the diffusing agent has a refractive index ranging from 1.4 to
 2. 11. The lighting module of claim 3, wherein the thickness of the first resin layer is in a range of 2.7 mm or less, and wherein the lighting module is provided with a thickness of 5.5 mm or less.
 12. The lighting module of claim 3, wherein the first diffusion layer includes ink particles, wherein the phosphor emits a red light and the ink particles has a red color.
 13. The lighting module of claim 12, wherein a side portion of the first diffusion layer contacts the substrate and includes the phosphor and the ink particles.
 14. The lighting module of claim 3, comprising a light shielding portion disposed between the first resin layer and the first diffusion layer and vertically overlapped with each of the light emitting devices.
 15. The lighting module of claim 3, comprising a second resin layer disposed on the first diffusion layer and including ink particles, wherein a content of the ink particles included in the second resin layer is 12 wt % or less in resin material of the second resin layer.
 16. A lighting module comprising: a substrate; a plurality of light emitting devices disposed on the substrate and emitting a wavelength in a range of 420 nm to 470 nm; a first resin layer disposed on the substrate and the plurality of the light emitting devices; and a first diffusion layer disposed on the first resin layer and including a phosphor; wherein a content of the phosphor included in the first diffusion layer is in a range of 10 wt % to 23 wt % in resin material of the first diffusion layer, and wherein the lighting module is provided with a thickness of 5.5 mm or less and emits a red light.
 17. The lighting module of claim 15, comprising a second resin layer disposed on the first diffusion layer and including ink particles, wherein a content of the ink particles included in the second resin layer is 12 wt % or less in resin material of the second resin layer, wherein the phosphor and the ink particles have a red color.
 18. The lighting module of claim 15, wherein the plurality of light emitting devices is arranged in N columns and M rows, wherein the N and M are integers of 2 or more, and wherein each of the plurality of light emitting devices includes a first electrode and a second electrode electrically connected to the substrate and facing an upper surface of the substrate.
 19. The lighting module of claim 18, wherein an interval between the plurality of light emitting devices is greater than or equal to a thickness of the first resin layer, and wherein the thickness of the first resin layer is in a range of 5 times or more a thickness of the substrate.
 20. The lighting module of claim 19, wherein the thickness of the first resin layer is greater than a thickness of the first diffusion layer, and wherein the thickness of the first resin layer is in a range of 2 mm to 2.7 mm. 